{"paper":{"title":"Enabling the Adoption of Processing-in-Memory: Challenges, Mechanisms, Future Research Directions","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.AR","authors_text":"Amirali Boroumand, Kevin Hsieh, Onur Mutlu, Rachata Ausavarungnirun, Saugata Ghose","submitted_at":"2018-02-01T15:00:38Z","abstract_excerpt":"Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a pin-limited memory channel to the CPU before any computation can take place. This requires a high latency and energy overhead, and the data often cannot benefit from caching in the CPU, making it difficult to amortize the overhead.\n  Modern 3D-stacked DRAM architectures include a logic layer, where compute logic can be integrated underneath multiple layers of DRAM "},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1802.00320","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}