{"paper":{"title":"An Extended Analytic Model for the Heating of Bondwires","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.CE","authors_text":"David Duque, Renaud Gillon, Sebastian Sch\\\"ops, Tomas Gotthans","submitted_at":"2017-09-28T17:19:50Z","abstract_excerpt":"We present an extended analytic formula for the calculation of the temperature profile along a bondwire embedded in a package. The resulting closed formula is built by coupling the heat transfer equations of the bondwire and the surrounding moulding compound by means of auxiliary variables that stem from an \\emph{ad-hoc} linearisation and mediate the wire-mould thermal interaction. The model, which corrects typical simplifications in previously introduced analytic models, is also optimised against carefully taken experimental samples representing fusing events of bondwires within real packages"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1709.10069","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}