{"paper":{"title":"Near-field scanning microwave microscope for interline capacitance characterization of nanoelectronics interconnect","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":["physics.ins-det"],"primary_cat":"cond-mat.mtrl-sci","authors_text":"Andrew R. Schwartz, Vladimir V. Talanov","submitted_at":"2011-08-10T17:28:55Z","abstract_excerpt":"We have developed a noncontact method for measurement of the interline capacitance in Cu/low-k interconnect. It is based on a miniature test vehicle with net capacitance of a few femto-Farads formed by two 20-\\mu m-long parallel wires (lines) with widths and spacings the same as those of the interconnect wires of interest. Each line is connected to a small test pad. The vehicle impedance is measured at 4 GHz by a near-field microwave probe with 10 \\mu m probe size via capacitive coupling of the probe to the vehicle's test pads. Full 3D finite element modeling at 4 GHz confirms that the microwa"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1108.2226","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}