{"paper":{"title":"Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"physics.ins-det","authors_text":"Aapo Varpula, Bernhard Wunderle, Corinna Grosse, Daniel May, Kestutis Grigoras, Mika Prunnila, Mohamad Abo Ras, Pierre-Olivier Chapuis, S\\'everine Gom\\`es","submitted_at":"2018-04-13T09:13:25Z","abstract_excerpt":"A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the bidirectional 3-omega method. The platform is composed of glass substrates on which sensor structures and a very thin dielectric nanolaminate passivation layer are fabricated. Using through-glass vias for contacting the sensors from the chip back side leaves the top side of the platform free for deposition, manipulation and optical inspection of the sample duri"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1804.04848","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}