{"paper":{"title":"Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cond-mat.supr-con","authors_text":"A. D. O'Connell, A. N. Cleland, D. Sank, Erik Lucero, H. Wang, John M. Martinis, J. Wenner, M. Lenander, M. Neeley, M. Weides, Radoslaw C. Bialczak","submitted_at":"2010-11-23T01:19:42Z","abstract_excerpt":"We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by the chip to ground capacitance. Using SPICE simulations and experimental measurements of a scale model, the basic predictions of the ladder model were verified. In particular, by decreasing the capacitance between the chip and box grounds, the resonance frequency increased and tr"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1011.4982","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}