{"paper":{"title":"Enhancing interfacial thermal conductance in Si/Diamond heterostructures by phonon bridge","license":"http://creativecommons.org/licenses/by/4.0/","headline":"","cross_cats":["physics.app-ph"],"primary_cat":"cond-mat.mtrl-sci","authors_text":"Ershuai Yin, Lei Wang, Qiang Li, Wenzhu Luo","submitted_at":"2025-07-30T08:56:42Z","abstract_excerpt":"This study investigates the mechanism of enhancing interfacial thermal transport performance in Silicon/Diamond (Si/Diamond) heterostructures using the phonon bridge. A heat transfer model for three-layer heterostructures is developed by combining First-principles calculations with the Monte Carlo method. The temperature distribution, spectral heat conductance, and interfacial thermal conductance are compared for Si/Diamond heterostructures with and without a silicon carbide (SiC) interlayer. The results show that the SiC interlayer effectively bridges low-frequency phonons in Si with mid-to-h"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2507.22490","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2507.22490/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}