{"paper":{"title":"Extensible 3D architecture for superconducting quantum computing","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"quant-ph","authors_text":"Guangming Xue, Haifeng Yu, Ke Zhang, Kunzhe Dai, Mengmeng Li, Qiang Liu, Xinsheng Tan, Yang Yu","submitted_at":"2017-05-07T09:46:32Z","abstract_excerpt":"Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operation"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1705.02586","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}