{"paper":{"title":"A Survey on Split Manufacturing: Attacks, Defenses, and Challenges","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.CR","authors_text":"Samuel Pagliarini, Tiago D. Perez","submitted_at":"2020-06-08T14:24:49Z","abstract_excerpt":"In today's integrated circuit (IC) ecosystem, owning a foundry is not economically viable, and therefore most IC design houses are now working under a fabless business model. In order to overcome security concerns associated with the outsorcing of IC fabrication, the Split Manufacturing technique was proposed. In Split Manufacturing, the Front End of Line (FEOL) layers (transistors and lower metal layers) are fabricated at an untrusted high-end foundry, while the Back End of Line (BEOL) layers (higher metal layers) are manufactured at a trusted low-end foundry. This approach hides the BEOL con"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2006.04627","kind":"arxiv","version":3},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2006.04627/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}