{"paper":{"title":"Cleaning Interfaces in Layered Materials Heterostructures","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cond-mat.mes-hall","authors_text":"A. C. Ferrari, A. Lombardo, D. G. Purdie, K. Watanabe, N. M. Pugno, T. Taniguchi","submitted_at":"2018-03-02T15:50:42Z","abstract_excerpt":"Heterostructures formed by stacking layered materials require atomically clean interfaces. However, contaminants are usually trapped between the layers, aggregating into blisters. We report a process to remove such blisters, resulting in clean interfaces. We fabricate blister-free regions of graphene encapsulated in hexagonal boron nitride of$\\sim$5000$\\mu $m$^{2}$, limited only by the size of the exfoliated flakes. These have mobilities up to$\\sim$180000cm$^2$V$^{-1}$s$^{-1}$ at room temperature, and$\\sim$1.8$\\times$10$^6$cm$^2$V$^{-1}$s$^{-1}$ at 9K. We further demonstrate the effectiveness "},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1803.00912","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}