{"paper":{"title":"Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"physics.app-ph","authors_text":"2), Andriy Yakymovych (1, Austria (2) Department of Metal Physics, Herbert Ipser (1) ((1) Department of Inorganic Chemistry (Materials Chemistry), Ihor Shtablavyi (2), Ivan Franko National University of Lviv, Stepan Mudry (2), Ukraine), University of Vienna","submitted_at":"2018-06-09T07:29:32Z","abstract_excerpt":"Sn-Ag-Cu (SAC) alloys are commonly recognized as lead-free solders employed in the electronics industry. However, some disadvantages in mechanical properties and their higher melting temperatures compared to Pb-Sn solders prompt new research relating to reinforcement of existing SAC solders. One of the ways to reinforce these solder materials is the formation of composites with nanoparticles as filler materials. Accordingly, this study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100-x(nanoCo)x solders with up to 0.8 wt.% nano Co. The effect of nano-sized Co particles was inve"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1806.06935","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}