{"paper":{"title":"Determination of Bond Wire Failure Probabilities in Microelectronic Packages","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.CE","authors_text":"Sebastian Sch\\\"ops, Thorben Casper, Ulrich R\\\"omer","submitted_at":"2016-09-18T16:50:47Z","abstract_excerpt":"This work deals with the computation of industry-relevant bond wire failure probabilities in microelectronic packages. Under operating conditions, a package is subject to Joule heating that can lead to electrothermally induced failures. Manufacturing tolerances result, e.g., in uncertain bond wire geometries that often induce very small failure probabilities requiring a high number of Monte Carlo (MC) samples to be computed. Therefore, a hybrid MC sampling scheme that combines the use of an expensive computer model with a cheap surrogate is used. The fraction of surrogate evaluations is maximi"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1609.06187","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}