{"paper":{"title":"Cooling Codes: Thermal-Management Coding for High-Performance Interconnects","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":["math.IT"],"primary_cat":"cs.IT","authors_text":"Alexander Vardy, Han Mao Kiah, Tuvi Etzion, Yeow Meng Chee","submitted_at":"2017-01-26T20:51:12Z","abstract_excerpt":"High temperatures have dramatic negative effects on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the thermal challenges posed by high-performance interconnects. In this paper, we introduce new efficient coding schemes that make it possible to directly control the peak temperature of a bus by effectively cooling its hottest wires. This is achieved by avoiding state transitions on the hottest wires for as long as necessary until their temperature drops off. We"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1701.07872","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}