{"paper":{"title":"Dispersion-Engineered Terahertz Silicon Interconnects Enabling Terabit-Scale Data Links","license":"http://creativecommons.org/licenses/by/4.0/","headline":"Dispersion-engineered unclad silicon waveguides enable 1.004 Tbps multi-band THz on-chip data links.","cross_cats":[],"primary_cat":"physics.optics","authors_text":"Bodhan Chakraborty, Guillaume Ducournau, Hadjer Nihel Khelil, Nikhil Navaratna, Pascal Szriftgiser, Ranjan Singh, Thomas CaiWei Tan, Wenhao Wang","submitted_at":"2026-05-16T06:59:38Z","abstract_excerpt":"The rapid growth of artificial intelligence (AI) and data-centric computing is driving exabyte-scale data transfer, pushing conventional interconnect technologies toward fundamental bandwidth and energy limits. Although optical interconnects provide high-capacity and long-reach communication, their complexity and energy overhead limit scalability in short-reach chiplet-based and on-chip systems. Terahertz (THz) silicon interconnects offer a promising alternative by bridging electronics and photonics in compact, complementary metal-oxide-semiconductor (CMOS)-compatible platforms capable of high"},"claims":{"count":4,"items":[{"kind":"strongest_claim","text":"We demonstrate a CMOS-compatible, centimetre-scale, multi-band on-chip THz data link achieving an aggregate throughput of 1.004 Tbps. The performance is enabled by suppressing Bragg-induced stopbands using dispersion-engineered, effective-medium-supported unclad silicon waveguides, resulting in flat transmission and low-ripple group delay across multiple THz bands.","source":"verdict.strongest_claim","status":"machine_extracted","claim_id":"C1","attestation":"unclaimed"},{"kind":"weakest_assumption","text":"That the dispersion-engineered effective-medium-supported unclad silicon waveguides will reliably suppress Bragg stopbands and deliver the stated low propagation loss, bending loss, and GVD (0.15 ps²/mm) over the full 220-500 GHz band in fabricated devices without unaccounted penalties.","source":"verdict.weakest_assumption","status":"machine_extracted","claim_id":"C2","attestation":"unclaimed"},{"kind":"one_line_summary","text":"Demonstrates dispersion-engineered unclad silicon THz waveguides enabling 1.004 Tbps aggregate throughput across multiple bands with low GVD and dual-polarization support in a CMOS-compatible platform.","source":"verdict.one_line_summary","status":"machine_extracted","claim_id":"C3","attestation":"unclaimed"},{"kind":"headline","text":"Dispersion-engineered unclad silicon waveguides enable 1.004 Tbps multi-band THz on-chip data links.","source":"verdict.pith_extraction.headline","status":"machine_extracted","claim_id":"C4","attestation":"unclaimed"}],"snapshot_sha256":"07fd8803cddce03abc5757971228a0df95990d4317986d06e6b597779d5d7ae9"},"source":{"id":"2605.16841","kind":"arxiv","version":1},"verdict":{"id":"d623ffa1-27c3-4f51-8050-20d3caab4a91","model_set":{"reader":"grok-4.3"},"created_at":"2026-05-19T19:51:29.724917Z","strongest_claim":"We demonstrate a CMOS-compatible, centimetre-scale, multi-band on-chip THz data link achieving an aggregate throughput of 1.004 Tbps. The performance is enabled by suppressing Bragg-induced stopbands using dispersion-engineered, effective-medium-supported unclad silicon waveguides, resulting in flat transmission and low-ripple group delay across multiple THz bands.","one_line_summary":"Demonstrates dispersion-engineered unclad silicon THz waveguides enabling 1.004 Tbps aggregate throughput across multiple bands with low GVD and dual-polarization support in a CMOS-compatible platform.","pipeline_version":"pith-pipeline@v0.9.0","weakest_assumption":"That the dispersion-engineered effective-medium-supported unclad silicon waveguides will reliably suppress Bragg stopbands and deliver the stated low propagation loss, bending loss, and GVD (0.15 ps²/mm) over the full 220-500 GHz band in fabricated devices without unaccounted penalties.","pith_extraction_headline":"Dispersion-engineered unclad silicon waveguides enable 1.004 Tbps multi-band THz on-chip data links."},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2605.16841/integrity.json","findings":[],"available":true,"detectors_run":[{"name":"doi_title_agreement","ran_at":"2026-05-19T20:01:19.008684Z","status":"completed","version":"1.0.0","findings_count":0},{"name":"doi_compliance","ran_at":"2026-05-19T20:00:46.811350Z","status":"completed","version":"1.0.0","findings_count":0},{"name":"claim_evidence","ran_at":"2026-05-19T18:41:56.321746Z","status":"completed","version":"1.0.0","findings_count":0},{"name":"ai_meta_artifact","ran_at":"2026-05-19T18:33:26.394356Z","status":"skipped","version":"1.0.0","findings_count":0}],"snapshot_sha256":"1cd0192cf395c7244db22fada74ed4fbc3b2a8e2ab5138569f4469c019b4127c"},"references":{"count":33,"sample":[{"doi":"","year":2018,"title":"Thraskias, C. A. et al. Survey of photonic and plasmonic interconnect technologies for intra- datacenter and high-performance computing communications. IEEE Commun. Surv. Tutorials 20, 2758–2783 (2018","work_id":"9961e8a3-e0b7-4938-9ef1-75c33b0255e4","ref_index":1,"cited_arxiv_id":"","is_internal_anchor":false},{"doi":"","year":2025,"title":"Network the Cloud: The Critical Role of the Network in Cloud Evolution","work_id":"6a31a3c7-4986-41ad-9847-c872ea53749f","ref_index":2,"cited_arxiv_id":"","is_internal_anchor":false},{"doi":"","year":2021,"title":"Minkenberg, C., Krishnaswamy, R., Zilkie, A. & Nelson, D. Co-packaged datacenter optics: Opportunities and challenges. IET Optoelectron. 15, 77–91 (2021)","work_id":"277e484d-1172-4077-acb8-a2d59de2dbff","ref_index":3,"cited_arxiv_id":"","is_internal_anchor":false},{"doi":"","year":2022,"title":"F., Han, C., Hu, Z., Nie, S","work_id":"b00ba268-6055-493c-9428-fef046048481","ref_index":4,"cited_arxiv_id":"","is_internal_anchor":false},{"doi":"","year":2018,"title":"Sengupta, K., Nagatsuma, T. & Mittleman, D. M. Terahertz integrated electronic and hybrid electronic–photonic systems. Nat. Electron. 1, 622–635 (2018)","work_id":"32c280de-64d3-4174-a915-ab49aa24f773","ref_index":5,"cited_arxiv_id":"","is_internal_anchor":false}],"resolved_work":33,"snapshot_sha256":"628b8a6708524efa4ec043f7cb12b1d39bbb6bb8a528b0839bcb277ed0edf37e","internal_anchors":0},"formal_canon":{"evidence_count":2,"snapshot_sha256":"ca66f8216ee83aeef975c7367d24ecc06d09517e147ba75b0f56bdd899b6a66f"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}