{"paper":{"title":"ProForm: Solder-Free Circuit Assembly Using Thermoforming","license":"http://creativecommons.org/licenses/by-nc-nd/4.0/","headline":"","cross_cats":["cond-mat.mtrl-sci"],"primary_cat":"cs.HC","authors_text":"Benyamin Davaji, Gregory D. Abowd, Jeffrey I. Lipton, Narjes Pourjafarian, Zhenming Yang","submitted_at":"2025-07-28T15:43:41Z","abstract_excerpt":"Electronic waste (e-waste) is a growing global challenge, with millions of functional components discarded due to the difficulty of repair and reuse. Traditional circuit assembly relies on soldering, which creates semi-permanent bonds that limit component recovery and contribute to unnecessary waste. We introduce ProForm, a thermoforming approach for solder-free circuit prototyping. By encapsulating electronic components with pressure-formed thermoplastics, ProForm enables secure, reversible mounting without the need for solder or custom mechanical housings. This approach supports a wide range"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2507.20933","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2507.20933/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}