{"paper":{"title":"E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.OH","authors_text":"Bei Yu, David Z. Pan, Jhih-Rong Gao, Kun Yuan","submitted_at":"2015-02-01T18:01:50Z","abstract_excerpt":"Electron beam lithography (EBL) is a promising maskless solution for the technology beyond 14nm logic node. To overcome its throughput limitation, industry has proposed character projection (CP) technique, where some complex shapes (characters) can be printed in one shot. Recently the traditional EBL system is extended into multi-column cell (MCC) system to further improve the throughput. In MCC system, several independent CPs are used to further speed-up the writing process. Because of the area constraint of stencil, MCC system needs to be packed/planned carefully to take advantage of the cha"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1502.00621","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}