{"paper":{"title":"A Universal Multi-Hierarchy Figure-of-Merit for On-Chip Computing and Communications","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.ET","authors_text":"Armin Mehrabian, Shuai Sun, Tarek El-Ghazawi, Vikram K. Narayana, Volker J. Sorger","submitted_at":"2016-12-07T23:30:20Z","abstract_excerpt":"Continuing demands for increased compute efficiency and communication bandwidth have led to the development of novel interconnect technologies with the potential to outperform conventional electrical interconnects. With a plurality of interconnect technologies to include electronics, photonics, plasmonics, and hybrids thereof, the simple approach of counting on-chip devices to capture performance is insufficient. While some efforts have been made to capture the performance evolution more accurately, they eventually deviate from the observed development pace. Thus, a holistic figure of merit (F"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1612.02486","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}