{"paper":{"title":"ePlace-3D: Electrostatics based Placement for 3D-ICs","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.OH","authors_text":"Chung-Kuan Cheng, Hao Zhuang, Ilgweon Kang, Jingwei Lu, Pengwen Chen","submitted_at":"2015-12-27T23:55:38Z","abstract_excerpt":"We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.15% shorter wirelength, 9.11% and 10.27% fewer 3D vertical interconnects (VI) on aver"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1512.08291","kind":"arxiv","version":5},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}