{"paper":{"title":"Grain Boundary Resistance in Copper Interconnects from an Atomistic Model to a Neural Network","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cond-mat.mtrl-sci","authors_text":"Daniel Valencia, Evan Wilson, Gerhard Klimeck, Gustavo A. Valencia-Zapata, Michael Povolotskyi, Zhengping Jiang","submitted_at":"2017-01-17T23:24:10Z","abstract_excerpt":"Orientation effects on the resistivity of copper grain boundaries are studied systematically with two different atomistic tight binding methods. A methodology is developed to model the resistivity of grain boundaries using the Embedded Atom Model, tight binding methods and non-equilibrum Green's functions (NEGF). The methodology is validated against first principles calculations for small, ultra-thin body grain boundaries (<5nm) with 6.4% deviation in the resistivity. A statistical ensemble of 600 large, random structures with grains is studied. For structures with three grains, it is found th"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1701.04897","kind":"arxiv","version":3},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}