{"paper":{"title":"Field-induced thermal metal-to-insulator transition in underdoped LSCO","license":"","headline":"","cross_cats":["cond-mat.str-el"],"primary_cat":"cond-mat.supr-con","authors_text":"D.G. Hawthorn, Etienne Boaknin, F. Ronning, H. Zhang, Johnpierre Paglione, Louis Taillefer, M.A. Tanatar, Mike Sutherland, R.W. Hill, S. Wakimoto","submitted_at":"2003-04-22T20:16:47Z","abstract_excerpt":"The transport of heat and charge in cuprates was measured in undoped and heavily-underdoped single crystal La_{2-x}Sr_xCuO_{4+delta} (LSCO). In underdoped LSCO, the thermal conductivity is found to decrease with increasing magnetic field in the T --> 0 limit, in striking contrast to the increase observed in all superconductors, including cuprates at higher doping. The suppression of superconductivity with magnetic field shows that a novel thermal metal-to-insulator transition occurs upon going from the superconducting state to the field-induced normal state."},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"cond-mat/0304495","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/cond-mat/0304495/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}