An optimized interdigitated cooling architecture for a GB200-like multi-chip package reduces peak chip temperature by 140.45°C and average temperature by 35.87°C versus baseline.
Deep Dive into NVIDIA GB200 Liq- uid Cooling Plate Design: Advanced Liquid Cool- ing for AI Chips
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Cooling Channel Design Optimization for High Power Multi-chip Packages
An optimized interdigitated cooling architecture for a GB200-like multi-chip package reduces peak chip temperature by 140.45°C and average temperature by 35.87°C versus baseline.