{"as_of":"2026-08-14T23:30:00Z","caps":{"database_statements":6,"inbound":100,"outbound":100},"context_digest":"sha256:fdab70a36bf0b8a75a154edd9dea1e1eb5d4ad33636b7bc76d56839c5f8c1054","coverage":[{"denominator":69,"lane":"reference_resolution","note":"Typed states for the displayed outbound observations.","records_observed":69,"source":"paper_references, paper_reference_links","source_observed_at":"2026-08-01T03:43:01.602215Z","state":"measured"},{"denominator":69,"lane":"standing_notices","note":"One-hop event checks from named stored sources.","records_observed":69,"source":"scholarly_work_events, retraction_status_cache","source_observed_at":"2026-08-14T06:32:32.682623+00:00","state":"measured"},{"denominator":0,"lane":"inbound_itemization","note":"Pith citing papers itemized under the disclosed page cap.","records_observed":0,"source":"paper_references, paper_reference_links","source_observed_at":null,"state":"measured"},{"denominator":1,"lane":"external_citation_measurements","note":"A source-named dated measurement, never combined with another source.","records_observed":0,"source":"cited_works","source_observed_at":null,"state":"measured"}],"external_citation_measurements":[],"inbound":[],"links":{"evidence":"/evidence","html":"/paper/2607.23082/citation-record","integrity":"/paper/2607.23082/integrity","json":"/paper/2607.23082/citation-record.json","paper":"/paper/2607.23082"},"outbound":[{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.235728Z","title":"Semico nductor supply chain resilience and disruption: insights, mitigation, an d future directions,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":1,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.235728Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:d15034b155d92930083f06ab13c4bb244f19ec576c0bc6bc6b6f45c5e65baa05","observation_id":"b3fe935b-534c-4e41-bdfd-86d99c667bd8","resolution":{"observed_at":"2026-08-01T03:43:01.235728Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.240752Z","title":"Understa nding systemic disruption from the Covid-19-induced semiconductor shortage for the auto industry,","venue":null,"work_id":null,"year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":2,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.240752Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b60411579d995f527ce14482d4aff9d7420a47640bb81b2808afcd573e35c4d3","observation_id":"3a780050-944a-402d-b4ce-9178c447c6cf","resolution":{"observed_at":"2026-08-01T03:43:01.240752Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1016/j.ijpe.2014.07.010","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Implications of the Tohoku earthqua ke for Toyota’s coordination mechanism: Supply chain disruption of automotive semiconductors,","venue":"International Journal of Production Economics","work_id":"00f22a4a-e38d-4bba-b3b9-a5b951190a3a","year":2015},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":3,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.245144Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:045d0e4cd9f052efb2d1c8a79df655a9a40ba8f928d7c3ce2493fce7fedcce09","observation_id":"cc6854c9-c3ac-4b97-8584-3dca4428a56a","resolution":{"observed_at":"2026-08-01T03:43:57.874503Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.249491Z","title":"With new export controls on critical mine rals, supply concentration risks become reality,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":4,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.249491Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:a2bcd385c08d7132115636f96e63b2b68399e874d1a67958c98f0e1d7800a985","observation_id":"cfcfea8b-0624-4697-a687-52c98ba93947","resolution":{"observed_at":"2026-08-01T03:43:01.249491Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.253652Z","title":"IRDS 2024 chapter-- Environment, safety, health & sustainability (ESHS): environmental sustainability of the semiconductor facilities (ESSF),","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":5,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.253652Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:2abd43caeb09bfd74de913f539af382c49284e6ec74fc90eaf05ff41904780bc","observation_id":"bd33b47d-071c-4627-86dc-e8a16176884f","resolution":{"observed_at":"2026-08-01T03:43:01.253652Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.258056Z","title":"Virtual metrolog y in semiconductor manufacturing: Current status and future prospects,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":6,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.258056Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:35935e12ba839ab4bc56c78b49c5049b31e1d57e1550b7147e8f7dd4050385ed","observation_id":"1be8c6b2-aa8a-4102-b84a-f7be5b2caaab","resolution":{"observed_at":"2026-08-01T03:43:01.258056Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.262608Z","title":"Virtual Metrology Model Robustness Against Chamber Condition Variation Using Deep Lear ning,","venue":null,"work_id":null,"year":2019},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":7,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.262608Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:bfbd96d0a201c7380f6463fdc31fbb7a023a9e4a52ba11ee2b94bd825926dd5c","observation_id":"8e31d0a9-687c-41e5-b47d-38ede1be4bcf","resolution":{"observed_at":"2026-08-01T03:43:01.262608Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.266473Z","title":"V irtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Pl asma,","venue":null,"work_id":null,"year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":8,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.266473Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:86ee6ff2709636a0bf7b748634ac92ab27359f9ca2cc5c6f7e5ce2d7015b9e51","observation_id":"bc441a6c-5e6c-4d0b-93d8-87781b51d4e7","resolution":{"observed_at":"2026-08-01T03:43:01.266473Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.270448Z","title":"M achine learning-based novelty detection for faulty wafer detection in sem iconductor manufacturing,","venue":null,"work_id":null,"year":2012},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":9,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.270448Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:ee710e535862a1c15f7c0c083c386a77e80f79c672116e951c16c7befbf8ee4b","observation_id":"a49cbf76-5adb-49e5-aba2-775820fd7835","resolution":{"observed_at":"2026-08-01T03:43:01.270448Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.274230Z","title":"Safe and sustainable by design - Research and innovation,","venue":null,"work_id":null,"year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":10,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.274230Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:af9a184ee557d43263c19daaf3d6f5837cfe70739579abfbefc8b18a347c663e","observation_id":"70aa327c-6333-4d07-9357-10861e686d97","resolution":{"observed_at":"2026-08-01T03:43:01.274230Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.278247Z","title":"Recommendations for making the European Commission ’s Safe and Sustainable by Design framework practicable for bio cides,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":11,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.278247Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:7185f6d8cd891eeeb4f12e7265c3b1d8f3cf31225aa96c3935f6bf439399e7c5","observation_id":"1fe06804-cd47-4d28-b5a3-0dc98eacb404","resolution":{"observed_at":"2026-08-01T03:43:01.278247Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.59490/dgo.2025.978","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Enhancing public procurement through GRC management: navigating the evolving EU regulatory landscape,","venue":"Conference on Digital Government Research","work_id":"7b315e21-1787-46ee-a8fb-a3cf4205fd99","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":12,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.282151Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:ce3605bab095054e8666c763182b93baad13dc17aaf9aa45f524ef8624b6933d","observation_id":"2aaf9293-e437-4c09-88fc-a1c85a9a70fe","resolution":{"observed_at":"2026-08-01T03:43:57.578088Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.286089Z","title":"Virtual metrology as an approach for product quality estima tion in Industry 4.0: a systematic review and integrative conceptual framework,","venue":null,"work_id":null,"year":null},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":13,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.286089Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:1b09645ce19ab6c33a58bab5a4b3806b3f9f5b2d7e382b4498a2f686b773baf9","observation_id":"e45798ff-b0f3-4975-951b-4f5344cf8223","resolution":{"observed_at":"2026-08-01T03:43:01.286089Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":{"arxiv_id":"2006.16522","last_updated":"2020-12-23T14:10:22Z","snapshot_observed_at":"2026-08-11T04:41:38.400729Z","submitted_at":"2020-06-30T04:35:58Z","title":"Echoes from a singularity","version":3},"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":"2006.16522","snapshot_observed_at":"2026-08-01T03:43:01.293944Z","title":"System of Systems - the meaning of of,","venue":null,"work_id":null,"year":2006},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":14,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.293944Z"},"links":{"cited_paper":"/paper/2006.16522","citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:a64c9faaa6e79b79fb5007df86aab863f9e8c607754cb362afee390ae186cec6","observation_id":"7d370f71-0df6-4d44-872a-2f9a488ded79","resolution":{"observed_at":"2026-08-01T03:43:01.293944Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.298215Z","title":"An integrated framework of Industry 3.5 and an empirical study of simulation-based automate d material handling system for semiconductor manufacturing,","venue":null,"work_id":null,"year":null},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":15,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.298215Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:639dca833a21a7ddcdf417308d7eef9650f6d8f658eaceec87d78c2b6071ed11","observation_id":"d27ea004-43c0-430a-b8c1-c08042d220fb","resolution":{"observed_at":"2026-08-01T03:43:01.298215Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.305711Z","title":"Integrated Semico nductor Supply Chain Production Planning,","venue":null,"work_id":null,"year":2016},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":16,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.305711Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:436e67984418bef4bce72fccb3f229a5b540ec6486dd62a5f91c5d4a1b9f876f","observation_id":"fccb3a72-f7f2-4029-89d3-0c5ac1f21f08","resolution":{"observed_at":"2026-08-01T03:43:01.305711Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.309652Z","title":"Integrating resilience and reliability in semiconductor supply chains during disruptions,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":17,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.309652Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:85a5627bcca238aa331637e6980a5dee25e5d196ff1c6f42e7568ff1e746bdd5","observation_id":"d80a33ea-aa12-408f-9ef4-0e0ec22dbec2","resolution":{"observed_at":"2026-08-01T03:43:01.309652Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.313508Z","title":"Structural resilie nce evolution and vulnerability assessment of semiconductor materials supply network in the global semiconductor industry,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":18,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.313508Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b8e8a5d83d69b544c1800f3a2f2934d26555a1f8836f7170cc270beef37ad4f9","observation_id":"32de2f20-fde5-4e1c-be90-04a64b18e209","resolution":{"observed_at":"2026-08-01T03:43:01.313508Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.317425Z","title":"Res ilient and sustainable semiconductor supply chain network design under tra de credit and uncertainty of supply and demand,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":19,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.317425Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:83a4ecc8e48f72434201724060758d9259d0696df73164db4ed6e71541ab93ae","observation_id":"04dbd7ac-3a73-42e3-932b-3467bcfd4d5f","resolution":{"observed_at":"2026-08-01T03:43:01.317425Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.321659Z","title":"Digital tra nsformation and innovation and business ecosystems: A bibliometric analysis for conceptual insights and collaborative practices for ecosystem innovation,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":20,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.321659Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:3cbcfb8713a998a83111157883ffcba7c4422a2f931cb25e61bea2ce6cbd3c79","observation_id":"a53a05f4-2a77-4f91-8768-64f0012dd8fa","resolution":{"observed_at":"2026-08-01T03:43:01.321659Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1177/09697764241303838","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"The geographies and geopolitics of industrial policy: Designing a data- driven UK semiconductor strategy,","venue":"European Urban and Regional Studies","work_id":"4673e13d-bf45-4ccb-8bd4-92bd13cbc239","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":21,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.325573Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:3e221ca82514296dc73371a9929c89d46d3362a5b0cf683acb7bd032d03c37dd","observation_id":"4fcd18e2-9b35-4eb3-bfe8-4539a275145f","resolution":{"observed_at":"2026-08-01T03:43:57.344358Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.329574Z","title":"The European Chips Act: Europe’s Quest for Semiconductor Autonomy,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":22,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.329574Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:9b790fa86fd5d000a0ab6447bbd592383e407e3778b76e74ac053d5440f90fbd","observation_id":"665f1942-d2b6-4e7f-97bb-54b70991100c","resolution":{"observed_at":"2026-08-01T03:43:01.329574Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.333413Z","title":"The paradox of semiconductors—EU governance between sovereignty and interdependence,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":23,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.333413Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:60edd33435019c426cada38b64d802939dff9fb49045cb60dcc4b1a16b4de95a","observation_id":"b280dee8-c26c-4e3a-afda-fb2f8788776d","resolution":{"observed_at":"2026-08-01T03:43:01.333413Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.337238Z","title":"From Overdependence to Independen ce: European Policy Frameworks for Semiconductor Supply Chain Resilienc e,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":24,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.337238Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:bf3f42300c1e91f36cdc8b3153eda9a28077ac91278d5ab28b9a79a5a7344337","observation_id":"dc5cfab4-960e-4b35-b162-6a0dd489f489","resolution":{"observed_at":"2026-08-01T03:43:01.337238Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.5194/egusphere-egu25-18950","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Navigating the pat h to sustainability: case study insights from Taiwan’s semiconductor sector,","venue":null,"work_id":"26d53048-1f7e-4e70-8d9e-1e7507a99bf1","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":25,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.341304Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:ec336c2045fac39b4756ca76232833acbb2a59ce6892e452394357fb05787977","observation_id":"85dca73e-6609-4fb7-bc12-b67ef3b89ffb","resolution":{"observed_at":"2026-08-01T03:43:57.172334Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.345093Z","title":"Sustainable global semiconductor supply chain network design considering ESG,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":26,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.345093Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b0572db47e48c91869e1e40ef6f797bb93481eb571af7678e46f922f10d475c4","observation_id":"a7bf9c22-13c7-4532-b435-ccbc27724abc","resolution":{"observed_at":"2026-08-01T03:43:01.345093Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.348816Z","title":"On the Need of International Cross-Data Space Interworking: An EU–Japan Case Study,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":27,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.348816Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:da2f59ce930bc2a1e83baa0e0414c10bfb92a0d5f79eab11f53d6af11eaad73c","observation_id":"379b0e77-27bf-4498-9763-40a790331fb4","resolution":{"observed_at":"2026-08-01T03:43:01.348816Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1016/j.cirp.2021.05.008","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Evolution and future of manufacturing systems,","venue":"CIRP Annals","work_id":"81f4b891-a553-4512-87d6-e854c3a1e745","year":2021},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":28,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.352620Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:0b6f2812abeea8b9f349b92dae209292960943a1316dfc43f67d05a4071d37dd","observation_id":"fc7d828c-dd83-4fa4-ba85-7edd3495f1a5","resolution":{"observed_at":"2026-08-01T03:43:56.914274Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-10T18:38:14.330709+00:00","source":"crossref_status_cache"},{"observed_at":"2026-08-10T18:38:14.330709+00:00","source":"openalex_status_cache"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.356591Z","title":"The Industry 5.0 framework: viability-based integration of the resilience, sustainability, and human-centricit y perspectives,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":29,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.356591Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:54f60bf96906dad10e658e40d8d058d5ef56b1b05620a517b083f867b16d16a7","observation_id":"3b6a081d-21c8-4c3f-bb57-f9fac6fede91","resolution":{"observed_at":"2026-08-01T03:43:01.356591Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1016/j.jmsy.2025.02.010","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"A multimodal hier archical learning approach for virtual metrology in semiconductor man ufacturing,","venue":"Journal of Manufacturing Systems","work_id":"97d39ddc-e289-4ad6-8d5c-252ec2398bd7","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":30,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.360201Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:6ea03ca13aae22f50fbdea1ea1ff6abdcf1b84b7ba27c0904326bb2d60b2491a","observation_id":"3d8f1b65-25fa-43e5-9891-8b34734a6852","resolution":{"observed_at":"2026-08-01T03:43:56.776324Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1117/12.3064772","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"GenAI applications of vision-language models for semiconductor defect classification,","venue":null,"work_id":"69a4acc5-38b5-4d91-8925-45be4b4096a7","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":31,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.364038Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:618de6f018089747d73bea1f671e48ae9edd2b70c59ffd4cadd903f7778a84f7","observation_id":"ee884a19-02c8-4be2-86c9-93d8bc237966","resolution":{"observed_at":"2026-08-01T03:43:56.633058Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1007/978-3-031-35479-3_3","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"F rom Industry 4.0 to Industry 5.0: The Triple Transition Digital, Green and Social","venue":"Topics in mining, metallurgy and materials engineering","work_id":"31df9639-9045-44f6-a4c3-8c678a352c44","year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":32,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.367823Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:3a8291813cb29b4e5da51298308a675ecf486044b8e7bceddbabe98513cd25a4","observation_id":"32751601-f6f2-4750-a295-bab9ba94acb9","resolution":{"observed_at":"2026-08-01T03:43:56.469698Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.372026Z","title":"Scientific mapping and systematic literature review on sociotechnical change and transition to Industry 5.0 or Society 5. 0,","venue":null,"work_id":null,"year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":33,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.372026Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:fe86ff14395c6c3b4ff9c188b3a324360bd91229427f300ccfd1232448bf04ef","observation_id":"7a361050-ee0d-439e-ab27-12c4d16e7f75","resolution":{"observed_at":"2026-08-01T03:43:01.372026Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.375959Z","title":"D igital product passports as enablers of digital circular economy: a framework based on technological perspective,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":34,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.375959Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:845662805c42d1c943cd0a769c190e52895278c6a28eec9dc25cb7c67ab07c1c","observation_id":"cf1b5ced-d4d1-4edd-9c3d-16533ef18984","resolution":{"observed_at":"2026-08-01T03:43:01.375959Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.379871Z","title":"Smart di gital platforms for carbon neutral management and services: business mo dels based on ITU standards for green digital transformation,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":35,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.379871Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:09f51927d5e1c7c3a8f31ccf999fe95b655626922fefc0720aad7499517cab8f","observation_id":"a9c397ca-839c-499b-b088-6c42d49937c0","resolution":{"observed_at":"2026-08-01T03:43:01.379871Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.383448Z","title":"Roadmap ping for strategy and innovation,","venue":null,"work_id":null,"year":2010},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":36,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.383448Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:69dcefaa85e2df01e1b9aafa6eb39895cea5a9614090c249ea905830a491cc60","observation_id":"a05512c5-02b7-4498-a0f4-ba81807849da","resolution":{"observed_at":"2026-08-01T03:43:01.383448Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.387219Z","title":"Emerging trends in roadmapping research: A bibliom etric literature review,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":37,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.387219Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:c0441713ddca64f682c02abaa38b0ccc9a94474ca430e8107512988754e3f106","observation_id":"2e8ea359-55d9-456c-a3ef-1efeaa7fb753","resolution":{"observed_at":"2026-08-01T03:43:01.387219Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.390766Z","title":"Geneva, Switzerland: International Telecommunication Union (ITU), 2020","venue":null,"work_id":null,"year":2020},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":38,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.390766Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:06bb5c41b41ebfc7350ad2bb108c782d8b4dbcf5f1b41b12bbd84d0d7b06c576","observation_id":"efa528f2-b142-478f-8302-f887194ab84e","resolution":{"observed_at":"2026-08-01T03:43:01.390766Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.394514Z","title":"Orchestrating the twin transition : sustainable AI and semiconductor ecosystems (RegTech & FinTech framewo rks),","venue":null,"work_id":null,"year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":39,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.394514Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:4e70f141d09b4de7842390b81dc296a45f8db9c71fb480ac760e98d9009cdd86","observation_id":"38b20042-0aeb-4b2d-9ced-2ce4b017c3ab","resolution":{"observed_at":"2026-08-01T03:43:01.394514Z","resolver_source":null,"status":"malformed_identifier"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.398350Z","title":"bibliometrix: an R-tool for comprehensive science mapping analysis,","venue":null,"work_id":null,"year":2017},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":40,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.398350Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:0c9280b23638a0a5c3504533cb26978690372ff61c6ac072bcf7146879d861b3","observation_id":"3983e905-e404-45a6-b47b-d7d9f079ac09","resolution":{"observed_at":"2026-08-01T03:43:01.398350Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.402520Z","title":"Introduction to bibliometrics for construction and maintenance of thesauri: Methodical considerations,","venue":null,"work_id":null,"year":2004},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":41,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.402520Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:3cf8d4c375c419723db39dc4f6cee849e99f47de9d503cef91a0eaa55d7f8f57","observation_id":"c30576ef-5f29-4104-a204-813393715a29","resolution":{"observed_at":"2026-08-01T03:43:01.402520Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.406370Z","title":"How to combine term clumping and technology roadmapping fo r newly emerging science & technology competitive intellige nce:","venue":null,"work_id":null,"year":2014},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":42,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.406370Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b5f025ae6303d8b08723b4f411317f73a710c32d9107ab2424bb58e93761f1e8","observation_id":"f361c7a7-7d1a-42dd-994d-9ecb389ac2f4","resolution":{"observed_at":"2026-08-01T03:43:01.406370Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.410330Z","title":"A semantic web- based risk assessment framework for collaborative planning to enhance overall supply chain effectiveness for semiconducto r industry,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":43,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.410330Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b4a4cbad5112de3c35f5df5d9462eefb7bb5ea886168eac2e1284a7517f69a6c","observation_id":"ad2851dd-79a5-4d96-8872-5c360e444ead","resolution":{"observed_at":"2026-08-01T03:43:01.410330Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1002/csr.70435","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Chips and challenges: an integrative review on sustainability and risk ma nagement in semiconductor supply chains,","venue":"Corporate Social Responsibility and Environmental Management","work_id":"f3f8fd4f-641a-48a9-b2b2-ec6f025000d0","year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":44,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.414085Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:73022d21cd45c103a677a3155fee163bc7a30b96c44e8f974945fc21f553050a","observation_id":"af24eb8d-41ba-4bae-9988-6d1b857a6bc7","resolution":{"observed_at":"2026-08-01T03:43:56.122043Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.417842Z","title":"The impact of supply chain risk complexity and concentration on f inancial and ESG performance in chinas semiconductor industry,","venue":null,"work_id":null,"year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":45,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.417842Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:6af3cbdea34f6957d58f6f4c4759c144ababdcb84a88fa8630bbbaa83042b8d9","observation_id":"58bee5b9-e66b-4601-b9ec-5acf3dbece90","resolution":{"observed_at":"2026-08-01T03:43:01.417842Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.421496Z","title":"SECS/GEMsec: a mechanism for detection and prevention of cyber-attacks on SECS/GEM communicati ons in industry 4.0 landscape,","venue":null,"work_id":null,"year":2021},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":46,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.421496Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:9f9074d376a58973065cf5bf9163091043f15488db4c7a42ffd03c7d54169c78","observation_id":"e9cffc97-8070-4739-8777-8539c6586cf2","resolution":{"observed_at":"2026-08-01T03:43:01.421496Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.425183Z","title":"Contact-less integrity verification of microelectronics using ne ar-field EM analysis,","venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":47,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.425183Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:cd72913f3d7b573d9c6d0b7070cf701548c1f8030aa0304a6f6493c9e7165a6b","observation_id":"27b1a32b-bb49-4b13-a9ee-b69b9a7483cd","resolution":{"observed_at":"2026-08-01T03:43:01.425183Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.428766Z","title":"A novel rolling -window and production-maintenance-based machine learning appro ach to virtual metrology in semiconductor manufacturing,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":48,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.428766Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:d60a875b2276011d51d6f13aaa89cb85186af1fc617e385918da1cde369d8a6f","observation_id":"1e6a6ae3-8fa2-4b5d-99da-0dd19de54d00","resolution":{"observed_at":"2026-08-01T03:43:01.428766Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.3390/asi8060183","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Review of Application s of Experimental Designs in Wafer Manufacturing,","venue":"Applied System Innovation","work_id":"5ddddca5-20cc-44ea-bd4d-a1f7065ba1b9","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":49,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.534271Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:f45b37cc855f122baa0f9f88b6cdbdc2a412236562a7a737e846806bd4de75d4","observation_id":"0f0090c1-066e-466b-8e72-ce4856d11cb3","resolution":{"observed_at":"2026-08-01T03:43:55.849218Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.538629Z","title":"Nanoelectronics-enabled reservoir computing hardware for real-time robotic controls,","venue":null,"work_id":null,"year":null},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":50,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.538629Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:da58a3a188427667d1864c932cd4f3b934f490362ad86b5d5813931984b0005b","observation_id":"ca744dce-1d2c-4cee-98ef-ffd782d06fb1","resolution":{"observed_at":"2026-08-01T03:43:01.538629Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.3390/su132313436","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Sustainable circular micro index for evaluating virtual substitution using mac hine learning with the path planning problem as a case study,","venue":"Sustainability","work_id":"5021923d-275f-4c05-b287-97fabc9898bd","year":2021},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":51,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.546620Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:5086e8e7f2e9e2b5128552aaae20c33d5d9f75ef184b55ed26991ac13e108535","observation_id":"bd8d01e5-9603-4bc6-8205-f2a01a89e95e","resolution":{"observed_at":"2026-08-01T03:43:55.334055Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.550480Z","title":"Standards: road mapping computer technology trends enlightens industry,","venue":null,"work_id":null,"year":null},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":52,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.550480Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b12c85ff5c4afa72ebb85597a313ac572efc1e9a6d64568314d44bffb420a940","observation_id":"fc66cb0a-7594-42a9-86b4-1fbeeb9f675e","resolution":{"observed_at":"2026-08-01T03:43:01.550480Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1371/journal.pone.0313162","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Analysis of the structure and robustness of the global semiconductor trade networ k,","venue":"PLoS ONE","work_id":"069fbd61-4869-460c-9b3d-5271b9d6e589","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":53,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.557722Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:97b96137ee508494f27a2c2e3da1ea27e2261421e6af68fa7e8e7ea1fdde4bf9","observation_id":"da1a47e2-8ac3-4e68-ae3d-6f026e771825","resolution":{"observed_at":"2026-08-01T03:43:55.097929Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.62051/25t71d58","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Strategies for managing perfluorinated compounds (PFCs) in semicon ductor manufacturing: a supply chain and public management approach,","venue":"Transactions on Engineering and Technology Research","work_id":"c5a4fb74-31e9-4a23-92de-b8059d148bf1","year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":54,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.561293Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:1453fe3bb64b1d2908a31811a033d886b530dc653af7931aead5bf74a428c0e8","observation_id":"08258f6d-f042-44f6-83fe-2c3bbefa6ea1","resolution":{"observed_at":"2026-08-01T03:43:54.883922Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.565150Z","title":"An overview of semicon ductor industry efforts to reduce PFAS use and emissions in plasma processes,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":55,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.565150Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:e3df052b5b64d178339ac0dcb201bbbb0b39c5e184f0ed166d2ec1b97c69ed0d","observation_id":"d4404475-bccf-4fd8-9f45-d1065237c4e6","resolution":{"observed_at":"2026-08-01T03:43:01.565150Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.3390/su17073160","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Sustainable transition of the global semiconductor industry: challenges, strategies, and future directions,","venue":"Sustainability","work_id":"e6abb846-e3d9-42b5-a19c-4da1daa0b45b","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":56,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.568766Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:c1c623fb429d47e5547fda1f11455ceb72536c29a40bc169e67a6ced42f99ac6","observation_id":"1c91789f-455c-4208-9c90-679e07035fe0","resolution":{"observed_at":"2026-08-01T03:43:54.583120Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.572304Z","title":"Transforming wastewater into resources: a review o f fluidized-bed homogeneous crystallization for sustainable treatme nt and recovery,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":57,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.572304Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:a777331da962886c7c1b9bf235c66611dd5b3c27ac93be3bbb6e6e58f2fbfdb9","observation_id":"29d8414d-8bc5-4957-8a8d-588f87789612","resolution":{"observed_at":"2026-08-01T03:43:01.572304Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.576012Z","title":"2024 IRDS edition: outside system connectivity,","venue":null,"work_id":null,"year":2024},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":58,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.576012Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:7f0e0aeeabcfaf083c5d28104ea8350059784cac6cc04a01427f0ed06dbeeadc","observation_id":"f04667c8-d94b-4009-8ff4-d5033c080ed4","resolution":{"observed_at":"2026-08-01T03:43:01.576012Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1007/s11192-025-05361-8","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Research quality evaluation by A I in the era of large language models: advantages, disadvantages, and systemic effects – an opinion paper,","venue":"Scientometrics","work_id":"c362a947-db8e-4702-8ea4-3832924eb970","year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":59,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.579656Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:990341672b5d8758973688c830a7b12d9efd520a1824ce1ecfcacf4546bbe3f8","observation_id":"abc0c76c-8f99-4b63-b7d5-0ebe7e055558","resolution":{"observed_at":"2026-08-01T03:43:54.322465Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.3390/informatics9010006","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"Transferrable framework based on knowledge graphs for generating explainable results in domain-specific, intelligent information retrieval,","venue":"Informatics","work_id":"ad0d2d81-cbac-4af4-b82b-3d1e8f25513d","year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":60,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.583335Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b3d660718b491189dc6cb96d6e77c52ed0e34517b948e3cbf65715e8591af417","observation_id":"6d67c6d9-9c97-4942-bff6-d169ceb77a7d","resolution":{"observed_at":"2026-08-01T03:43:54.077025Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1162/qss.a.460","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":"A global south str ategy for evaluating research value with ChatGPT,","venue":"Quantitative Science Studies","work_id":"947bd656-3b85-480a-b76a-4090780e5fde","year":2026},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":61,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.587206Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:68ad9f115bb47b01b12aba8d4b55493d721745fa409640172291aa5389f37f4f","observation_id":"d492d33e-b698-4d5d-9a91-333eae8d1ac8","resolution":{"observed_at":"2026-08-01T03:43:53.852422Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.590888Z","title":"Industrial multi-machine data aggregation, AI-ready data preparation, and machine learning for virtual metro logy in semiconductor wafer and slider production,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":62,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.590888Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:e5ce9547e38b543664a1d6ecf60f715be5d3066c46f9244f1fccf14d33c7f153","observation_id":"393b6e9b-f626-4e33-a484-5eb14e31d15c","resolution":{"observed_at":"2026-08-01T03:43:01.590888Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.594728Z","title":"A proactive approach of optimizing real-time equipment monitori ng settings for enhancing end-of-line yield,","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":63,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.594728Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:a703bdd7f7038526afe9cbda58914d72dc59ed0d75bf96b2b2129494ef9b4597","observation_id":"0b524d54-ec67-43e1-a1dc-2144595f6b31","resolution":{"observed_at":"2026-08-01T03:43:01.594728Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.598667Z","title":"Virtual metrology in semiconductor fabrication foundry using deep learni ng neural networks,","venue":null,"work_id":null,"year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":64,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.598667Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:6a5b703f7efa09f7f43161c966b50c2d6e76b77f19d703c085514a591b8aff9f","observation_id":"fc94c180-3478-470d-950d-045f8e5f8b30","resolution":{"observed_at":"2026-08-01T03:43:01.598667Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.602215Z","title":"The duo of artificial intelligence and big data for Industry 4.0: applications, techniques, challenges, and futu re research directions,","venue":null,"work_id":null,"year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":65,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.602215Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:1a6fb142981c54d705a0f3be2794a00fa3c16ce3cb58fd1d6f35a2a35b4437c3","observation_id":"9ba4a6ce-49fc-438d-a4d7-aa82d021d1eb","resolution":{"observed_at":"2026-08-01T03:43:01.602215Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.554284Z","title":null,"venue":null,"work_id":null,"year":2018},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":2018,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.554284Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:12a4491d8e369328cdc12efbeabcc3464f9573c8f59fdb692d020cfe265af5d5","observation_id":"fb1f3fb5-6b33-40cb-b95f-831d7c0f7849","resolution":{"observed_at":"2026-08-01T03:43:01.554284Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.290111Z","title":null,"venue":null,"work_id":null,"year":2021},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":2022,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.290111Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:a9a33289017456d781d509ecd90626c3833d59de09401de0eeaaf654eeb3113e","observation_id":"a44d60b3-fe66-4a31-9b12-047ed67bd6a7","resolution":{"observed_at":"2026-08-01T03:43:01.290111Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-01T03:43:01.302023Z","title":null,"venue":null,"work_id":null,"year":2022},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":2024,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.302023Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:5b1a067ee52588f5e284f5ce82281af72e0af0ddc8e90d65ffb5c840f8ec7982","observation_id":"db6e6e1b-0fa7-4f49-b53f-04fce5a4942c","resolution":{"observed_at":"2026-08-01T03:43:01.302023Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.1126/sciadv.adu2663","metadata_source":"openalex","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-05T02:28:24.338817Z","title":null,"venue":"Science Advances","work_id":"62a9576b-335b-408f-9b98-539cc2f714d0","year":null},"citing_paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)","version":1},"reference_index":2025,"source":"pdf_text","source_observed_at":"2026-08-01T03:43:01.542525Z"},"links":{"citing_paper":"/paper/2607.23082"},"observation_digest":"sha256:b0a6733998d315ac0a9f6bc5876ea86a588e11781b8a5f750139f963327d3614","observation_id":"212d5fb4-9f6d-459a-9d73-73980f17887f","resolution":{"observed_at":"2026-08-01T03:43:55.590285Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-14T06:32:32.682623+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"state":"measured"}}],"paper":{"arxiv_id":"2607.23082","last_updated":"2026-07-25T07:08:44Z","latest_version":1,"primary_category":"cs.SI","snapshot_observed_at":"2026-08-11T23:29:06.043872Z","submitted_at":"2026-07-25T07:08:44Z","title":"Scoping Review of AI, Metrology, and ESG in the Semiconductor Sector: Implications for Safe and Sustainable by Design (SSbD)"},"reference_resolution":{"displayed":69,"state_counts":{"malformed_identifier":1,"metadata_mismatch":0,"parse_uncertain":0,"unresolved":50,"verified_exact":18,"verified_fuzzy":0},"total_outbound_references":69},"refusal":"A citation records a reference. It does not transfer a finding from one paper to another.","schema":"pith.paper-citation-record.v1","standing_sources":[{"observed_at":"2026-08-14T06:32:32.682623+00:00","source":"crossref"},{"observed_at":"2026-08-14T06:32:18.44784+00:00","source":"retraction_watch"}],"thesis":"As of 14 August 2026, this Paper Citation Record lists 69 of 69 outbound references and 0 inbound Pith citation observations for arXiv:2607.23082."}