{"as_of":"2026-08-13T01:10:00Z","caps":{"database_statements":6,"inbound":100,"outbound":100},"context_digest":"sha256:f4a1b8c526c69ed52c4ab0aa9856a4863e9ec3cf1261e4446d2c9f2b3d94f10c","coverage":[{"denominator":43,"lane":"reference_resolution","note":"Typed states for the displayed outbound observations.","records_observed":43,"source":"paper_references, paper_reference_links","source_observed_at":"2026-08-10T10:46:14.249353Z","state":"measured"},{"denominator":44,"lane":"standing_notices","note":"One-hop event checks from named stored sources.","records_observed":44,"source":"scholarly_work_events, retraction_status_cache","source_observed_at":"2026-08-12T06:34:41.77262+00:00","state":"measured"},{"denominator":1,"lane":"inbound_itemization","note":"Pith citing papers itemized under the disclosed page cap.","records_observed":1,"source":"paper_references, paper_reference_links","source_observed_at":"2026-08-10T10:46:14.076290Z","state":"measured"},{"denominator":1,"lane":"external_citation_measurements","note":"A source-named dated measurement, never combined with another source.","records_observed":0,"source":"pith","source_observed_at":"2026-08-10T10:46:14.569868Z","state":"measured"}],"external_citation_measurements":[],"inbound":[{"citation":{"cited_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"cited_work":{"arxiv_id":"2608.07306","doi":null,"metadata_source":"pith","pith_arxiv_id":"2608.07306","snapshot_observed_at":"2026-08-10T10:46:14.569868Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","venue":"quant-ph","work_id":"ceb61794-ad1b-4d3d-a104-1aeb58828e4a","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":106,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.076290Z"},"links":{"cited_paper":"/paper/2608.07306","citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:981d29b0dbd0ea7df6939b5824ff6f1ee478fa3e0b0c1abb009f63f8d7365d06","observation_id":"d584fe95-5ca1-4868-962f-462129ea5c55","resolution":{"observed_at":"2026-08-10T10:46:14.575541Z","resolver_source":"local_arxiv","status":"malformed_identifier"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}}],"links":{"evidence":"/evidence","html":"/paper/2608.07306/citation-record","integrity":"/paper/2608.07306/integrity","json":"/paper/2608.07306/citation-record.json","paper":"/paper/2608.07306"},"outbound":[{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.083039Z","title":"Acharyaet al., Quantum error correction below the surface code threshold, Nature638, 920 (2025)","venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":1,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.083039Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:b43eaf5fb1c47f4bbbd4a4d7edcb1f8af186572f990b48e6396e9dc23f757862","observation_id":"3c4e75b7-e7a1-476b-9897-aff063a0f4ef","resolution":{"observed_at":"2026-08-10T10:46:14.083039Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:15.054459Z","title":"Carrera Vazquez, C","venue":null,"work_id":"41686e87-b29a-45e7-89ce-4558ad5fd1af","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":2,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.087512Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:53d2fb71c07788eacfe7bb3d044117b84825f6f4fff01978767e574829a8d7be","observation_id":"f87dac37-1027-47b1-89cf-b446304b9f3c","resolution":{"observed_at":"2026-08-10T10:46:15.058634Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.092213Z","title":"Aruteet al., Quantum supremacy using a pro- grammable superconducting processor, Nature574, 505 (2019)","venue":null,"work_id":null,"year":2019},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":3,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.092213Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:b03c09ff59f6c5bc8cb8007ab5db490ef1e65ac092d7e3e86b7580365f4a4c85","observation_id":"4281ac90-8ba5-43ed-b3be-49f5033c9535","resolution":{"observed_at":"2026-08-10T10:46:14.092213Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.096344Z","title":"Blais, S","venue":null,"work_id":null,"year":2020},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":4,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.096344Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:74026bf4fc8d3173675dee8f8469982e7fd270875f4fd849da9af308d5cf7b8e","observation_id":"541164bd-fff0-4699-9892-7ab9b694bc65","resolution":{"observed_at":"2026-08-10T10:46:14.096344Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:15.022574Z","title":"Kosenet al., Building blocks of a flip-chip integrated superconducting quantum processor, Quantum Science and Technology7, 035018 (2022)","venue":null,"work_id":"1fc25453-c709-4892-82d2-340ddfb5190e","year":2022},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":5,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.100768Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:6aabc9c97248335f4a7796fdce712d75d9b2091e5fa8a6572cd7c5fb30ef7de8","observation_id":"37e4f29c-9f3e-4ec1-a907-331aa21c4217","resolution":{"observed_at":"2026-08-10T10:46:15.027761Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:15.008630Z","title":"Rosenberg, D","venue":null,"work_id":"9b5dbc9f-a0c5-4db5-b534-585a1ba90b5f","year":2017},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":6,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.105430Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:67e29abc8f28de0d05fdf21537d52aafc1ef19e8de093be0857237be78c3d126","observation_id":"64038438-b366-466d-a1a1-e174bc474e70","resolution":{"observed_at":"2026-08-10T10:46:15.012945Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.995395Z","title":"Brecht, W","venue":null,"work_id":"321aaf4d-5e84-4408-bfbe-115939b6acd8","year":2016},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":7,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.109431Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:1b68d1060827681809cc9dab09c2bc1c1bdb6d4e3c2235ae61d39b88aa1bf5bf","observation_id":"31ba3213-9d31-45ff-a03d-888b4acd8f8e","resolution":{"observed_at":"2026-08-10T10:46:14.999762Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.982154Z","title":null,"venue":null,"work_id":"6dffb491-b240-4868-9615-5df174c3a231","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":8,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.113358Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:564c266f0b125fbbafc76dac42f25acf97dc83e085f5b0601f36e536c5cebacc","observation_id":"8d35ffa0-fc43-4e8b-978c-65e42f148c3c","resolution":{"observed_at":"2026-08-10T10:46:14.986152Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.969116Z","title":"Scappucci, C","venue":null,"work_id":"a14f4839-4bb5-416b-a1a6-be1e27f5be7d","year":2021},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":9,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.117469Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:073af9136aaee87a792baa8b2a5f2c7307752f8c42eaf6cb088d2bc4126706a9","observation_id":"1951bb89-ffb9-4d2c-9395-e4d2712d2565","resolution":{"observed_at":"2026-08-10T10:46:14.973427Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.955844Z","title":null,"venue":null,"work_id":"d8099103-2fa5-49a2-9cf8-c767a429dabe","year":2015},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":10,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.121579Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:830259f47e5f1f30db3438c3b83871a8f64bef17210086c1f31b8e98a03ff82d","observation_id":"48c81d7b-6a62-49ca-ae53-0b3c3bbfb53c","resolution":{"observed_at":"2026-08-10T10:46:14.960210Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.125798Z","title":null,"venue":null,"work_id":null,"year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":11,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.125798Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:4db7e9b7ec55c61f3a9e034697e7139565dc9006a000889582e597c6cef82119","observation_id":"754589d9-58f6-44dc-b28c-791dcf96a03d","resolution":{"observed_at":"2026-08-10T10:46:14.125798Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.129828Z","title":null,"venue":null,"work_id":null,"year":2023},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":12,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.129828Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:c5e9187d55051315c7eb12f38c92c1dadf678bbe24b54ced919a1c3bd66b3611","observation_id":"4f142fb6-8094-46b1-8c69-b258acc2d98f","resolution":{"observed_at":"2026-08-10T10:46:14.129828Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.934787Z","title":"Foxen, J","venue":null,"work_id":"32311f74-3f39-4b16-90ad-a3a29e672792","year":2017},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":13,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.133804Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:1a5b50d92ccc443da1bc0a1444f2f2ee8877aca376b696274578230aa1b4b683","observation_id":"fc9254fa-563c-4e69-bb9c-199b765d1cd0","resolution":{"observed_at":"2026-08-10T10:46:14.938772Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.922227Z","title":null,"venue":null,"work_id":"a7a1726b-958c-40c9-8f8b-862b683c67bb","year":2021},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":14,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.137860Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:985c2c1c1111ae0f3facc75fe0b0207d45bff4660b43f1b302887cc10734a688","observation_id":"811cb184-ba2c-41d5-87c1-c5cd058a6d22","resolution":{"observed_at":"2026-08-10T10:46:14.926415Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.910004Z","title":"Granel, F","venue":null,"work_id":"d7be293e-1136-457a-913b-3b7a4f532481","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":15,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.141909Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:4bc7c088f9fe668e527133f2694d2f854b859d0051da2b67d8f2c9c220cc6b1a","observation_id":"f6096e05-b532-497f-92c7-b4e5db550572","resolution":{"observed_at":"2026-08-10T10:46:14.914025Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.897582Z","title":"Kosen, H.-X","venue":null,"work_id":"022b6e1c-7768-4b73-a5cc-d022aa3181fa","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":16,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.145894Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:2eae02c75f4fc2678864bea296377989ac094191a35d5e6fbddc04bd85238d76","observation_id":"5d2ff109-1d20-4277-a0a8-7fe49ca761fe","resolution":{"observed_at":"2026-08-10T10:46:14.901647Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.884806Z","title":null,"venue":null,"work_id":"6442723b-ab42-49a9-b238-a63ab495897c","year":2021},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":17,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.149932Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:8b8fa5de8b87bd2aa84e1b6f829ce8874aa9ff96313b95f876fa562994a47ffe","observation_id":"089e668a-6366-43eb-a0bb-90a711b6f9bb","resolution":{"observed_at":"2026-08-10T10:46:14.888872Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.872272Z","title":null,"venue":null,"work_id":"3a442b6e-e31c-4ce7-98e0-a0026f7a786d","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":18,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.154596Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:a91c0d48f273a40c116c62a434de229f34f1732d8a2fa1ed42ac3121eb80042d","observation_id":"419d2cc0-cd61-4534-8e05-854db4695391","resolution":{"observed_at":"2026-08-10T10:46:14.876239Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.859603Z","title":"Telkamp, T","venue":null,"work_id":"97ccc389-4b79-4efb-bec7-de369a4222db","year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":19,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.158659Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:caaf420f6150d0ded91799448878785df195e42b998b405208643114b15e47a0","observation_id":"6a22a854-ab18-4a1b-955e-2be54651ecb4","resolution":{"observed_at":"2026-08-10T10:46:14.863837Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.846836Z","title":"Hinderling, D","venue":null,"work_id":"a50d1fc2-b531-45bc-aeb3-1e20a171b8bf","year":2023},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":20,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.162578Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:0e69fd412a362ac92374af463936d9c79239e322ae0804abd8df6b5fef7b8235","observation_id":"afac07fe-c6ec-4b06-b536-74ab522eea4a","resolution":{"observed_at":"2026-08-10T10:46:14.850860Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.833976Z","title":"Hinderling, S","venue":null,"work_id":"41a828dd-0b05-4e52-a692-f49b9e9f1b65","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":21,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.166488Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:e52e23738828f51104eb41ddd4724891de455a8663b9572370c6e68713ab6884","observation_id":"846e2868-eee6-4792-8a03-258132d29344","resolution":{"observed_at":"2026-08-10T10:46:14.838129Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.821019Z","title":null,"venue":null,"work_id":"be96af7c-3a78-49a8-8712-a79b50b4acb6","year":2020},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":22,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.170494Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:aa65f833145dcb54626a4530dd7dce9de1b7591f7d4eebdc466de11afe4e50b7","observation_id":"b43ccbd0-c1fb-4c62-b08d-b00bd80b565a","resolution":{"observed_at":"2026-08-10T10:46:14.825296Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.808229Z","title":"Holman, D","venue":null,"work_id":"65ea1b03-a0bc-419f-a587-66d087d6bdc2","year":2021},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":23,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.174469Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:461f9ef508f27e581e27cf69e2a9088fadb16a808de635d57439713d9a6fcae0","observation_id":"f15dd852-547f-4371-9a03-73e1531c5f4c","resolution":{"observed_at":"2026-08-10T10:46:14.812383Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.794338Z","title":"Jiang, S","venue":null,"work_id":"a45d93a8-ca74-4897-81da-1100a3fc61ad","year":2004},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":24,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.178282Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:54f34049a04133ebe6ea7c41e64c519541b8c1376a189ed53af1adaab1aeed94","observation_id":"fa2159c1-fd01-460f-bb60-bf0b1f57ea3f","resolution":{"observed_at":"2026-08-10T10:46:14.798973Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":"10.3390/s25010263","metadata_source":"doi_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.278345Z","title":null,"venue":null,"work_id":"7aa09613-a3c8-4a8b-833d-2bb44bd31188","year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":25,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.182185Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:4b9e7dcebfbb413537a5dd7898c3a1d7c8575f84c2319b24e4b627b613d4fc8e","observation_id":"0ec2cecd-52c7-469f-96f1-54e49d3d39f8","resolution":{"observed_at":"2026-08-10T10:46:14.283822Z","resolver_source":"doi","status":"verified_exact"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.779737Z","title":"Gharibaanet al., (in preparation) (to appear), (2026)","venue":null,"work_id":"5e17ee4f-8841-41f0-8426-1c02a5a4255a","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":26,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.186048Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:5e58359c18ed8e3e6a6014018c830220114bf8724abee6931edcf8b27ce9c315","observation_id":"b297861a-0d48-415b-802b-d4f26e2e3235","resolution":{"observed_at":"2026-08-10T10:46:14.784079Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.767108Z","title":null,"venue":null,"work_id":"dcec31bb-d2e5-4931-94d6-cb166f189f66","year":2019},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":27,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.190176Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:0eea02f0a16be6b915e2726fdbe1e120fd1935efe29ba6cc70697358a9dc9b48","observation_id":"27f856be-758b-40d9-bb0c-8f89eee3182d","resolution":{"observed_at":"2026-08-10T10:46:14.771131Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.754268Z","title":"Makita, S","venue":null,"work_id":"6e3a22f2-d285-4d04-ab4d-d7185223d4b3","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":28,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.194027Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:306994b833aa2a02e7e2a08d55b72e5acf59ad14161e066e488f9b208717a5cb","observation_id":"85e90e55-4a10-4d76-a347-eaeb84b57bf6","resolution":{"observed_at":"2026-08-10T10:46:14.758420Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.741685Z","title":null,"venue":null,"work_id":"0c1d5ccd-09ac-4b21-a74f-15bb72db1272","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":29,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.197913Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:d48e4b07844f40a800026cc00e2a431bcae90d32d23776b3ffaefe1dac0b475e","observation_id":"daf0140e-1029-4329-b5d8-23257b87d279","resolution":{"observed_at":"2026-08-10T10:46:14.745698Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.728757Z","title":null,"venue":null,"work_id":"157e1ca8-77ce-429e-9c42-3dc1f8df90bf","year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":30,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.201889Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:be8d0b3c4afae0f00ca82a2db1acba3401e7b8e49b81521ddbe00befb6c7e4e9","observation_id":"b649b177-d091-46e6-9bf6-cf540d9888a8","resolution":{"observed_at":"2026-08-10T10:46:14.732903Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.205678Z","title":"Dunsworth, A","venue":null,"work_id":null,"year":2017},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":31,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.205678Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:39bc6e63e54d6bc2febc9d7b3aa19228a83290f777c309331e735172347526fa","observation_id":"e50631d9-64c6-4466-b442-b94f97dac00c","resolution":{"observed_at":"2026-08-10T10:46:14.205678Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.707455Z","title":null,"venue":null,"work_id":"b9537236-94b6-4607-a134-d8ea050ebf4b","year":2018},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":32,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.209684Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:72b22513f2614f170b3fe7131d6aad8cf3f6949a1d52325942c37fa9d760d06e","observation_id":"202e2e04-8aaf-43c2-afd8-0dfbb07b608b","resolution":{"observed_at":"2026-08-10T10:46:14.711437Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.694427Z","title":"Müller, J","venue":null,"work_id":"0c099c6b-66b4-4b8f-bdee-5d1147ade1a6","year":2015},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":33,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.213525Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:8b1ef6e99b77e3d31dd982d62e145cb2f6f0e740eee524b2c498f03aa78b8ae9","observation_id":"f6d56381-a652-4d7d-a910-117a56499bd4","resolution":{"observed_at":"2026-08-10T10:46:14.698584Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.681235Z","title":"Wenner, R","venue":null,"work_id":"54afc75f-f218-4692-8dba-3b8c259e4f4c","year":2011},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":34,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.217465Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:b3e38c325f395e8c129ec15d7b1c92ee09f16a8d2e7cd5f0e58fa009f2fc654d","observation_id":"e28b92da-0248-47be-870a-127b1c0c9848","resolution":{"observed_at":"2026-08-10T10:46:14.685331Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.221588Z","title":null,"venue":null,"work_id":null,"year":2015},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":35,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.221588Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:177b17a5c59264bfe65b56b508e0168bb987ed22cebe65eb30ced20574963ed6","observation_id":"602f210f-d929-4f14-9446-a0a9efdc4eba","resolution":{"observed_at":"2026-08-10T10:46:14.221588Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.659391Z","title":"Barends, N","venue":null,"work_id":"0d334c01-4880-4ce4-aeda-15419809f5a2","year":2010},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":36,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.225558Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:8cb3fa67fb47f25c2c25f8185985d35c82cc8dca92cec6e38f7df3ada4cb540e","observation_id":"8780a0d6-d7af-4be9-b309-79946900e3f1","resolution":{"observed_at":"2026-08-10T10:46:14.663846Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.645692Z","title":"Kroll, F","venue":null,"work_id":"dd32e585-4f74-4c07-8151-88e851878424","year":2019},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":37,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.229615Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:40b382472da9053ba67c0c0ddf32d60a9ad5322e2e15e961b561dab5ccea4765","observation_id":"07469a05-5bfa-4d14-b795-7d0d0c764d1c","resolution":{"observed_at":"2026-08-10T10:46:14.649769Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.632870Z","title":null,"venue":null,"work_id":"16dadd1c-4a51-4b20-9b71-8fa40d36e3dd","year":2024},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":38,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.233601Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:d0ff7b42889e964d49b81856031e5d3f38e87f9fada3c6683d7f67aafc4a16ed","observation_id":"547108c8-a09e-4471-acdc-91a7249fcea6","resolution":{"observed_at":"2026-08-10T10:46:14.636994Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.619442Z","title":"Pita-Vidal, J","venue":null,"work_id":"7ae357b1-1e5f-4da6-a756-8970bd3cd01a","year":2025},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":39,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.237527Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:b13c4dec977ee8577e6e6e618ef1a7752803b36fcb9aa3073bbf5efc8206423b","observation_id":"fdf80d68-c614-46ce-8fa3-5c744e9cfc1a","resolution":{"observed_at":"2026-08-10T10:46:14.623825Z","resolver_source":"raw_fallback","status":"verified_fuzzy"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.606174Z","title":null,"venue":null,"work_id":"e0365c1e-da7a-4586-8a4b-731c5ca7b2b7","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":40,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.241461Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:2b223a89f654a762682080e640032dc69052ce69c6344c76d2449e1f12a935a7","observation_id":"9979513b-f453-4199-adad-2216a3412124","resolution":{"observed_at":"2026-08-10T10:46:14.610433Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":"raw_reference","pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.593066Z","title":null,"venue":null,"work_id":"3cf1f279-d1dd-4bb4-831c-241c9cd03c5a","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":41,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.245384Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:83a0651caba48ec6b7114f5d0eea4826ecd1e1c9fcb23d6c244a73df517f5a7a","observation_id":"7bd2d6c3-be00-4417-8ebe-4a16154bfbe0","resolution":{"observed_at":"2026-08-10T10:46:14.597295Z","resolver_source":"raw_fallback","status":"unresolved"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}},{"citation":{"cited_paper":null,"cited_work":{"arxiv_id":null,"doi":null,"metadata_source":null,"pith_arxiv_id":null,"snapshot_observed_at":"2026-08-10T10:46:14.249353Z","title":"Singh, E","venue":null,"work_id":null,"year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":42,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.249353Z"},"links":{"citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:7b3d6d370e66ea128dcfee6a027a1d0cd4617480ef206f051666d42bddf0c840","observation_id":"0c439c47-af4a-4c54-886b-daaea4f8c830","resolution":{"observed_at":"2026-08-10T10:46:14.249353Z","resolver_source":null,"status":"unresolved"},"standing_notice":{"events":[],"reason":"canonical_work_link_unavailable","source_receipts":[],"state":"unavailable"}},{"citation":{"cited_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"cited_work":{"arxiv_id":"2608.07306","doi":null,"metadata_source":"pith","pith_arxiv_id":"2608.07306","snapshot_observed_at":"2026-08-10T10:46:14.569868Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","venue":"quant-ph","work_id":"ceb61794-ad1b-4d3d-a104-1aeb58828e4a","year":2026},"citing_paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","version":1},"reference_index":106,"source":"pdf_text","source_observed_at":"2026-08-10T10:46:14.076290Z"},"links":{"cited_paper":"/paper/2608.07306","citing_paper":"/paper/2608.07306"},"observation_digest":"sha256:981d29b0dbd0ea7df6939b5824ff6f1ee478fa3e0b0c1abb009f63f8d7365d06","observation_id":"d584fe95-5ca1-4868-962f-462129ea5c55","resolution":{"observed_at":"2026-08-10T10:46:14.575541Z","resolver_source":"local_arxiv","status":"malformed_identifier"},"standing_notice":{"events":[],"observation":"No event found in the named queried sources as of 2026-08-12T06:34:41.77262+00:00.","reason":null,"source_receipts":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"state":"measured"}}],"paper":{"arxiv_id":"2608.07306","last_updated":"2026-08-07T15:01:24Z","latest_version":1,"primary_category":"quant-ph","snapshot_observed_at":"2026-08-12T23:12:44.920954Z","submitted_at":"2026-08-07T15:01:24Z","title":"Flip-chip integrated superconducting qubits using electroplated bump bonds"},"reference_resolution":{"displayed":43,"state_counts":{"malformed_identifier":1,"metadata_mismatch":0,"parse_uncertain":0,"unresolved":21,"verified_exact":1,"verified_fuzzy":20},"total_outbound_references":43},"refusal":"A citation records a reference. It does not transfer a finding from one paper to another.","schema":"pith.paper-citation-record.v1","standing_sources":[{"observed_at":"2026-08-12T06:34:41.77262+00:00","source":"crossref"},{"observed_at":"2026-08-12T06:34:36.333875+00:00","source":"retraction_watch"}],"thesis":"As of 13 August 2026, this Paper Citation Record lists 43 of 43 outbound references and 1 inbound Pith citation observation for arXiv:2608.07306."}