Periodic Variation of Stress in Sputter Deposited Si/WSi2 Multilayers

A tension increment after sputter deposition of 1 nm of WSi2 onto sputtered Si was observed at low Ar gas pressures. Wafer curvature data on multilayers were found to have a periodic variation corresponding to the multilayer period, and this permitted statistical analyses to improve the sensitivity to small stresses. The observation of tension instead of compression in the initial stage of growth is new and a model invoking surface rearrangement is invoked. The data also bear on an unusual surface smoothing phenomena for sputtered Si surfaces caused by the sputter deposition of WSi2 . We furthermore report that for low Ar pressures the Si layers are the predominant source of built-up stress.