{"record_type":"pith_number_record","schema_url":"https://pith.science/schemas/pith-number/v1.json","pith_number":"pith:2021:3EWETBUCC77N3BFNZN5VOSRDHY","short_pith_number":"pith:3EWETBUC","schema_version":"1.0","canonical_sha256":"d92c49868217fedd84adcb7b574a233e2f3b4c5b9d3602078eab484888a9c357","source":{"kind":"arxiv","id":"2112.02717","version":2},"attestation_state":"computed","paper":{"title":"Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor","license":"http://creativecommons.org/licenses/by/4.0/","headline":"","cross_cats":[],"primary_cat":"quant-ph","authors_text":"Alberto Ronzani, Amr Osman, Andreas Wallraff, Anita Fadavi Roudsari, Anton Frisk Kockum, Christian Kri\\v{z}an, Christopher Eichler, Christopher Warren, Daniel P\\'erez Lozano, Daryoush Shiri, Giovanna Tancredi, G\\\"oran Johansson, Graham Norris, Hang-Xi Li, Jaakko Salonen, Janka Bizn\\'arov\\'a, Jonas Bylander, Joonas Govenius, Jorge Fern\\'andez-Pend\\'as, Kestutis Grigoras, Leif Gr\\\"onberg, Liangyu Chen, Marco Caputo, Marcus Rommel, Sandoko Kosen, Slawomir Simbierowicz, Tahereh Abad","submitted_at":"2021-12-06T00:14:59Z","abstract_excerpt":"We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\\,\\mu s$, single-qubit gate fidelities exceeding $99.9\\%$, and two-qubit gate fidelities above $98.6\\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baselin"},"verification_status":{"content_addressed":true,"pith_receipt":true,"author_attested":false,"weak_author_claims":0,"strong_author_claims":0,"externally_anchored":false,"storage_verified":false,"citation_signatures":0,"replication_records":0,"graph_snapshot":true,"references_resolved":false,"formal_links_present":false},"canonical_record":{"source":{"id":"2112.02717","kind":"arxiv","version":2},"metadata":{"license":"http://creativecommons.org/licenses/by/4.0/","primary_cat":"quant-ph","submitted_at":"2021-12-06T00:14:59Z","cross_cats_sorted":[],"title_canon_sha256":"d197d4f1e08c7b7c41e5a8bd1e3c0615ca31fe1caf43fb5a30be73d74bd4982b","abstract_canon_sha256":"69466bef40a93df329aa610b0484627dd590276bd80414663424364a234e0d53"},"schema_version":"1.0"},"receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-07-05T04:31:28.504158Z","signature_b64":"dRFp66I+TAznF4WfKMAVLTIc/iuZ2Mr1MN7qFDeVld6Wr084/2PeeoRRU/fqcdiv3H9RyBXrWFI4j/ii/CZdDQ==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"d92c49868217fedd84adcb7b574a233e2f3b4c5b9d3602078eab484888a9c357","last_reissued_at":"2026-07-05T04:31:28.503607Z","signature_status":"signed_v1","first_computed_at":"2026-07-05T04:31:28.503607Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"graph_snapshot":{"paper":{"title":"Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor","license":"http://creativecommons.org/licenses/by/4.0/","headline":"","cross_cats":[],"primary_cat":"quant-ph","authors_text":"Alberto Ronzani, Amr Osman, Andreas Wallraff, Anita Fadavi Roudsari, Anton Frisk Kockum, Christian Kri\\v{z}an, Christopher Eichler, Christopher Warren, Daniel P\\'erez Lozano, Daryoush Shiri, Giovanna Tancredi, G\\\"oran Johansson, Graham Norris, Hang-Xi Li, Jaakko Salonen, Janka Bizn\\'arov\\'a, Jonas Bylander, Joonas Govenius, Jorge Fern\\'andez-Pend\\'as, Kestutis Grigoras, Leif Gr\\\"onberg, Liangyu Chen, Marco Caputo, Marcus Rommel, Sandoko Kosen, Slawomir Simbierowicz, Tahereh Abad","submitted_at":"2021-12-06T00:14:59Z","abstract_excerpt":"We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\\,\\mu s$, single-qubit gate fidelities exceeding $99.9\\%$, and two-qubit gate fidelities above $98.6\\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baselin"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2112.02717","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2112.02717/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"aliases":[{"alias_kind":"arxiv","alias_value":"2112.02717","created_at":"2026-07-05T04:31:28.503672+00:00"},{"alias_kind":"arxiv_version","alias_value":"2112.02717v2","created_at":"2026-07-05T04:31:28.503672+00:00"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.2112.02717","created_at":"2026-07-05T04:31:28.503672+00:00"},{"alias_kind":"pith_short_12","alias_value":"3EWETBUCC77N","created_at":"2026-07-05T04:31:28.503672+00:00"},{"alias_kind":"pith_short_16","alias_value":"3EWETBUCC77N3BFN","created_at":"2026-07-05T04:31:28.503672+00:00"},{"alias_kind":"pith_short_8","alias_value":"3EWETBUC","created_at":"2026-07-05T04:31:28.503672+00:00"}],"events":[],"event_summary":{},"paper_claims":[],"inbound_citations":{"count":1,"internal_anchor_count":1,"sample":[{"citing_arxiv_id":"2506.16361","citing_title":"Design of Advanced Readout and System-on-Chip Analog Circuits for Quantum Chip","ref_index":1,"is_internal_anchor":true}]},"formal_canon":{"evidence_count":0,"sample":[],"anchors":[]},"links":{"html":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY","json":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY.json","graph_json":"https://pith.science/api/pith-number/3EWETBUCC77N3BFNZN5VOSRDHY/graph.json","events_json":"https://pith.science/api/pith-number/3EWETBUCC77N3BFNZN5VOSRDHY/events.json","paper":"https://pith.science/paper/3EWETBUC"},"agent_actions":{"view_html":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY","download_json":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY.json","view_paper":"https://pith.science/paper/3EWETBUC","resolve_alias":"https://pith.science/api/pith-number/resolve?arxiv=2112.02717&json=true","fetch_graph":"https://pith.science/api/pith-number/3EWETBUCC77N3BFNZN5VOSRDHY/graph.json","fetch_events":"https://pith.science/api/pith-number/3EWETBUCC77N3BFNZN5VOSRDHY/events.json","actions":{"anchor_timestamp":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY/action/timestamp_anchor","attest_storage":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY/action/storage_attestation","attest_author":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY/action/author_attestation","sign_citation":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY/action/citation_signature","submit_replication":"https://pith.science/pith/3EWETBUCC77N3BFNZN5VOSRDHY/action/replication_record"}},"created_at":"2026-07-05T04:31:28.503672+00:00","updated_at":"2026-07-05T04:31:28.503672+00:00"}