{"record_type":"pith_number_record","schema_url":"https://pith.science/schemas/pith-number/v1.json","pith_number":"pith:2023:GDCUJKQCRU6LG6WYAMFRCV6LIA","short_pith_number":"pith:GDCUJKQC","schema_version":"1.0","canonical_sha256":"30c544aa028d3cb37ad8030b1157cb402c58742087429dffd7ac883c00252849","source":{"kind":"arxiv","id":"2308.08376","version":2},"attestation_state":"computed","paper":{"title":"Automated Semiconductor Defect Inspection in Scanning Electron Microscope Images: a Systematic Review","license":"http://creativecommons.org/licenses/by-nc-nd/4.0/","headline":"","cross_cats":[],"primary_cat":"cs.CV","authors_text":"Bappaditya Dey, Enrique Dehaerne, Sandip Halder, Stefan De Gendt, Thibault Lechien, Victor Blanco, Wannes Meert","submitted_at":"2023-08-16T13:59:43Z","abstract_excerpt":"A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical failures and wafer-yield limitations. As nodes and patterns get smaller, even high-resolution imaging techniques such as Scanning Electron Microscopy (SEM) produce noisy images due to operating close to sensitivity levels and due to varying physical properties of different underlayers or resist materials. This inherent noise is one of the main challenges for "},"verification_status":{"content_addressed":true,"pith_receipt":true,"author_attested":false,"weak_author_claims":0,"strong_author_claims":0,"externally_anchored":false,"storage_verified":false,"citation_signatures":0,"replication_records":0,"graph_snapshot":true,"references_resolved":false,"formal_links_present":false},"canonical_record":{"source":{"id":"2308.08376","kind":"arxiv","version":2},"metadata":{"license":"http://creativecommons.org/licenses/by-nc-nd/4.0/","primary_cat":"cs.CV","submitted_at":"2023-08-16T13:59:43Z","cross_cats_sorted":[],"title_canon_sha256":"6ddf7d1dbcc4c043d11cea8154a042d2c4200100acfefef291c0b23c3d954869","abstract_canon_sha256":"321d3004db9d2837182de6d819eed4026269943bc7d87277f89d9813f080976b"},"schema_version":"1.0"},"receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-07-05T06:42:25.333246Z","signature_b64":"pkuhfBgcEUB8+Z45dZZrvLXpjKdZsjzdZ1k0JME3gnX62+LnDnRvrqfXbLzMCfx99NKwapVOblrp2B5qy8sRAg==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"30c544aa028d3cb37ad8030b1157cb402c58742087429dffd7ac883c00252849","last_reissued_at":"2026-07-05T06:42:25.332826Z","signature_status":"signed_v1","first_computed_at":"2026-07-05T06:42:25.332826Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"graph_snapshot":{"paper":{"title":"Automated Semiconductor Defect Inspection in Scanning Electron Microscope Images: a Systematic Review","license":"http://creativecommons.org/licenses/by-nc-nd/4.0/","headline":"","cross_cats":[],"primary_cat":"cs.CV","authors_text":"Bappaditya Dey, Enrique Dehaerne, Sandip Halder, Stefan De Gendt, Thibault Lechien, Victor Blanco, Wannes Meert","submitted_at":"2023-08-16T13:59:43Z","abstract_excerpt":"A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical failures and wafer-yield limitations. As nodes and patterns get smaller, even high-resolution imaging techniques such as Scanning Electron Microscopy (SEM) produce noisy images due to operating close to sensitivity levels and due to varying physical properties of different underlayers or resist materials. This inherent noise is one of the main challenges for "},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2308.08376","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2308.08376/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"aliases":[{"alias_kind":"arxiv","alias_value":"2308.08376","created_at":"2026-07-05T06:42:25.332885+00:00"},{"alias_kind":"arxiv_version","alias_value":"2308.08376v2","created_at":"2026-07-05T06:42:25.332885+00:00"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.2308.08376","created_at":"2026-07-05T06:42:25.332885+00:00"},{"alias_kind":"pith_short_12","alias_value":"GDCUJKQCRU6L","created_at":"2026-07-05T06:42:25.332885+00:00"},{"alias_kind":"pith_short_16","alias_value":"GDCUJKQCRU6LG6WY","created_at":"2026-07-05T06:42:25.332885+00:00"},{"alias_kind":"pith_short_8","alias_value":"GDCUJKQC","created_at":"2026-07-05T06:42:25.332885+00:00"}],"events":[],"event_summary":{},"paper_claims":[],"inbound_citations":{"count":1,"internal_anchor_count":1,"sample":[{"citing_arxiv_id":"2608.02540","citing_title":"You're Gonna Need a Bigger Core: Calibrating Massive Star Models against Galactic OB-type Stars","ref_index":292,"is_internal_anchor":true}]},"formal_canon":{"evidence_count":0,"sample":[],"anchors":[]},"links":{"html":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA","json":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA.json","graph_json":"https://pith.science/api/pith-number/GDCUJKQCRU6LG6WYAMFRCV6LIA/graph.json","events_json":"https://pith.science/api/pith-number/GDCUJKQCRU6LG6WYAMFRCV6LIA/events.json","paper":"https://pith.science/paper/GDCUJKQC"},"agent_actions":{"view_html":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA","download_json":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA.json","view_paper":"https://pith.science/paper/GDCUJKQC","resolve_alias":"https://pith.science/api/pith-number/resolve?arxiv=2308.08376&json=true","fetch_graph":"https://pith.science/api/pith-number/GDCUJKQCRU6LG6WYAMFRCV6LIA/graph.json","fetch_events":"https://pith.science/api/pith-number/GDCUJKQCRU6LG6WYAMFRCV6LIA/events.json","actions":{"anchor_timestamp":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA/action/timestamp_anchor","attest_storage":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA/action/storage_attestation","attest_author":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA/action/author_attestation","sign_citation":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA/action/citation_signature","submit_replication":"https://pith.science/pith/GDCUJKQCRU6LG6WYAMFRCV6LIA/action/replication_record"}},"created_at":"2026-07-05T06:42:25.332885+00:00","updated_at":"2026-07-05T06:42:25.332885+00:00"}