{"record_type":"pith_number_record","schema_url":"https://pith.science/schemas/pith-number/v1.json","pith_number":"pith:2013:GS5CPS56BGZOZYJ4ZCM4NZJ5LK","short_pith_number":"pith:GS5CPS56","schema_version":"1.0","canonical_sha256":"34ba27cbbe09b2ece13cc899c6e53d5a848b8e6226e5bb2becd195a69274bb74","source":{"kind":"arxiv","id":"1310.5854","version":2},"attestation_state":"computed","paper":{"title":"Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"physics.ins-det","authors_text":"A.Macchiolo, H-G.Moser, L.Andricek, M.Beimforde, P.Weigell, R.H.Richter, R.Nisius, S.Terzo","submitted_at":"2013-10-22T09:32:19Z","abstract_excerpt":"The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules "},"verification_status":{"content_addressed":true,"pith_receipt":true,"author_attested":false,"weak_author_claims":0,"strong_author_claims":0,"externally_anchored":false,"storage_verified":false,"citation_signatures":0,"replication_records":0,"graph_snapshot":true,"references_resolved":false,"formal_links_present":false},"canonical_record":{"source":{"id":"1310.5854","kind":"arxiv","version":2},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"physics.ins-det","submitted_at":"2013-10-22T09:32:19Z","cross_cats_sorted":[],"title_canon_sha256":"1034edf2c02ca0ce02476b595804349261841b7a659c7c53fed1b4c222bd15ec","abstract_canon_sha256":"92d3ed2f6990468b0a8bb411226b2028b90ca05e0ff8a89fa63dd3f6775db0b1"},"schema_version":"1.0"},"receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-05-18T02:46:22.723886Z","signature_b64":"2XhzPLM1zqw3gJlrf+HQXlRLHWF3FnSSENGORG2uU4jIop2mKMc4MnPfbyIVzdlaxTiO7RCDMtJa32qmiocjCw==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"34ba27cbbe09b2ece13cc899c6e53d5a848b8e6226e5bb2becd195a69274bb74","last_reissued_at":"2026-05-18T02:46:22.723361Z","signature_status":"signed_v1","first_computed_at":"2026-05-18T02:46:22.723361Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"graph_snapshot":{"paper":{"title":"Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"physics.ins-det","authors_text":"A.Macchiolo, H-G.Moser, L.Andricek, M.Beimforde, P.Weigell, R.H.Richter, R.Nisius, S.Terzo","submitted_at":"2013-10-22T09:32:19Z","abstract_excerpt":"The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules "},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1310.5854","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"aliases":[{"alias_kind":"arxiv","alias_value":"1310.5854","created_at":"2026-05-18T02:46:22.723459+00:00"},{"alias_kind":"arxiv_version","alias_value":"1310.5854v2","created_at":"2026-05-18T02:46:22.723459+00:00"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.1310.5854","created_at":"2026-05-18T02:46:22.723459+00:00"},{"alias_kind":"pith_short_12","alias_value":"GS5CPS56BGZO","created_at":"2026-05-18T12:27:45.050594+00:00"},{"alias_kind":"pith_short_16","alias_value":"GS5CPS56BGZOZYJ4","created_at":"2026-05-18T12:27:45.050594+00:00"},{"alias_kind":"pith_short_8","alias_value":"GS5CPS56","created_at":"2026-05-18T12:27:45.050594+00:00"}],"events":[],"event_summary":{},"paper_claims":[],"inbound_citations":{"count":0,"internal_anchor_count":0,"sample":[]},"formal_canon":{"evidence_count":0,"sample":[],"anchors":[]},"links":{"html":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK","json":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK.json","graph_json":"https://pith.science/api/pith-number/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/graph.json","events_json":"https://pith.science/api/pith-number/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/events.json","paper":"https://pith.science/paper/GS5CPS56"},"agent_actions":{"view_html":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK","download_json":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK.json","view_paper":"https://pith.science/paper/GS5CPS56","resolve_alias":"https://pith.science/api/pith-number/resolve?arxiv=1310.5854&json=true","fetch_graph":"https://pith.science/api/pith-number/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/graph.json","fetch_events":"https://pith.science/api/pith-number/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/events.json","actions":{"anchor_timestamp":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/action/timestamp_anchor","attest_storage":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/action/storage_attestation","attest_author":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/action/author_attestation","sign_citation":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/action/citation_signature","submit_replication":"https://pith.science/pith/GS5CPS56BGZOZYJ4ZCM4NZJ5LK/action/replication_record"}},"created_at":"2026-05-18T02:46:22.723459+00:00","updated_at":"2026-05-18T02:46:22.723459+00:00"}