{"record_type":"pith_number_record","schema_url":"https://pith.science/schemas/pith-number/v1.json","pith_number":"pith:2022:JMOSWC5VUBMLRJSLHIIBJ4AH34","short_pith_number":"pith:JMOSWC5V","schema_version":"1.0","canonical_sha256":"4b1d2b0bb5a058b8a64b3a1014f007df1b787351dc5b9b4b0ad799e7114b842c","source":{"kind":"arxiv","id":"2203.12554","version":2},"attestation_state":"computed","paper":{"title":"Temperature mapping of stacked silicon dies from x-ray diffraction intensities","license":"http://creativecommons.org/licenses/by/4.0/","headline":"","cross_cats":["cond-mat.mtrl-sci"],"primary_cat":"physics.app-ph","authors_text":"Darshan Chalise, David G. Cahill, Peter Kenesei, Sarvjit D. Shastri","submitted_at":"2022-03-23T17:13:28Z","abstract_excerpt":"Increasing power densities in integrated circuits has led to an increased prevalence of thermal hotspots in integrated circuits. Tracking these thermal hotspots is imperative to prevent circuit failures. In 3D integrated circuits, conventional surface techniques like infrared thermometry are unable to measure 3D temperature distribution and optical and magnetic resonance techniques are difficult to apply due to the presence of metals and large current densities. X-rays offer high penetration depth and can be used to probe 3D structures. We report a method utilizing the temperature dependence o"},"verification_status":{"content_addressed":true,"pith_receipt":true,"author_attested":false,"weak_author_claims":0,"strong_author_claims":0,"externally_anchored":false,"storage_verified":false,"citation_signatures":0,"replication_records":0,"graph_snapshot":true,"references_resolved":false,"formal_links_present":false},"canonical_record":{"source":{"id":"2203.12554","kind":"arxiv","version":2},"metadata":{"license":"http://creativecommons.org/licenses/by/4.0/","primary_cat":"physics.app-ph","submitted_at":"2022-03-23T17:13:28Z","cross_cats_sorted":["cond-mat.mtrl-sci"],"title_canon_sha256":"0ceab3c8f741346528e633fa8bf0aaf9582db6f62289086e1f9dbde6db49e451","abstract_canon_sha256":"5cff3a15d01b28c58ee82a9a7e80259cf4412ac13afa69564be7e69a86956175"},"schema_version":"1.0"},"receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-07-05T04:59:40.501164Z","signature_b64":"vqdY8OGP0TF+CuKrBSFEISuBquIQtmoqQPLrMPpKbfvxNAbFZWP+AO3EjFnhTs1vGegLfwGvACkgRHCiNcjAAA==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"4b1d2b0bb5a058b8a64b3a1014f007df1b787351dc5b9b4b0ad799e7114b842c","last_reissued_at":"2026-07-05T04:59:40.500697Z","signature_status":"signed_v1","first_computed_at":"2026-07-05T04:59:40.500697Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"graph_snapshot":{"paper":{"title":"Temperature mapping of stacked silicon dies from x-ray diffraction intensities","license":"http://creativecommons.org/licenses/by/4.0/","headline":"","cross_cats":["cond-mat.mtrl-sci"],"primary_cat":"physics.app-ph","authors_text":"Darshan Chalise, David G. Cahill, Peter Kenesei, Sarvjit D. Shastri","submitted_at":"2022-03-23T17:13:28Z","abstract_excerpt":"Increasing power densities in integrated circuits has led to an increased prevalence of thermal hotspots in integrated circuits. Tracking these thermal hotspots is imperative to prevent circuit failures. In 3D integrated circuits, conventional surface techniques like infrared thermometry are unable to measure 3D temperature distribution and optical and magnetic resonance techniques are difficult to apply due to the presence of metals and large current densities. X-rays offer high penetration depth and can be used to probe 3D structures. We report a method utilizing the temperature dependence o"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2203.12554","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2203.12554/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"aliases":[{"alias_kind":"arxiv","alias_value":"2203.12554","created_at":"2026-07-05T04:59:40.500763+00:00"},{"alias_kind":"arxiv_version","alias_value":"2203.12554v2","created_at":"2026-07-05T04:59:40.500763+00:00"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.2203.12554","created_at":"2026-07-05T04:59:40.500763+00:00"},{"alias_kind":"pith_short_12","alias_value":"JMOSWC5VUBML","created_at":"2026-07-05T04:59:40.500763+00:00"},{"alias_kind":"pith_short_16","alias_value":"JMOSWC5VUBMLRJSL","created_at":"2026-07-05T04:59:40.500763+00:00"},{"alias_kind":"pith_short_8","alias_value":"JMOSWC5V","created_at":"2026-07-05T04:59:40.500763+00:00"}],"events":[],"event_summary":{},"paper_claims":[],"inbound_citations":{"count":0,"internal_anchor_count":0,"sample":[]},"formal_canon":{"evidence_count":0,"sample":[],"anchors":[]},"links":{"html":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34","json":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34.json","graph_json":"https://pith.science/api/pith-number/JMOSWC5VUBMLRJSLHIIBJ4AH34/graph.json","events_json":"https://pith.science/api/pith-number/JMOSWC5VUBMLRJSLHIIBJ4AH34/events.json","paper":"https://pith.science/paper/JMOSWC5V"},"agent_actions":{"view_html":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34","download_json":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34.json","view_paper":"https://pith.science/paper/JMOSWC5V","resolve_alias":"https://pith.science/api/pith-number/resolve?arxiv=2203.12554&json=true","fetch_graph":"https://pith.science/api/pith-number/JMOSWC5VUBMLRJSLHIIBJ4AH34/graph.json","fetch_events":"https://pith.science/api/pith-number/JMOSWC5VUBMLRJSLHIIBJ4AH34/events.json","actions":{"anchor_timestamp":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34/action/timestamp_anchor","attest_storage":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34/action/storage_attestation","attest_author":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34/action/author_attestation","sign_citation":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34/action/citation_signature","submit_replication":"https://pith.science/pith/JMOSWC5VUBMLRJSLHIIBJ4AH34/action/replication_record"}},"created_at":"2026-07-05T04:59:40.500763+00:00","updated_at":"2026-07-05T04:59:40.500763+00:00"}