{"bundle_type":"pith_open_graph_bundle","bundle_version":"1.0","pith_number":"pith:2016:PNB2I4EABOL7B775HSAMJ6B4FT","short_pith_number":"pith:PNB2I4EA","canonical_record":{"source":{"id":"1605.01789","kind":"arxiv","version":1},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.mtrl-sci","submitted_at":"2016-05-05T23:41:52Z","cross_cats_sorted":[],"title_canon_sha256":"1b1ffa0fc792629a3a4d4178fa48fb83aa27f6946de08efc66e7af466b25c16b","abstract_canon_sha256":"23a41b98eae78357789980a3d22b7a380f871acf5f14c89712f7b7d0ffacad89"},"schema_version":"1.0"},"canonical_sha256":"7b43a470800b97f0fffd3c80c4f83c2cf608beacd787e6e4b30df6e0a1ac340d","source":{"kind":"arxiv","id":"1605.01789","version":1},"source_aliases":[{"alias_kind":"arxiv","alias_value":"1605.01789","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"arxiv_version","alias_value":"1605.01789v1","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.1605.01789","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"pith_short_12","alias_value":"PNB2I4EABOL7","created_at":"2026-05-18T12:30:39Z"},{"alias_kind":"pith_short_16","alias_value":"PNB2I4EABOL7B775","created_at":"2026-05-18T12:30:39Z"},{"alias_kind":"pith_short_8","alias_value":"PNB2I4EA","created_at":"2026-05-18T12:30:39Z"}],"events":[{"event_type":"record_created","subject_pith_number":"pith:2016:PNB2I4EABOL7B775HSAMJ6B4FT","target":"record","payload":{"canonical_record":{"source":{"id":"1605.01789","kind":"arxiv","version":1},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.mtrl-sci","submitted_at":"2016-05-05T23:41:52Z","cross_cats_sorted":[],"title_canon_sha256":"1b1ffa0fc792629a3a4d4178fa48fb83aa27f6946de08efc66e7af466b25c16b","abstract_canon_sha256":"23a41b98eae78357789980a3d22b7a380f871acf5f14c89712f7b7d0ffacad89"},"schema_version":"1.0"},"canonical_sha256":"7b43a470800b97f0fffd3c80c4f83c2cf608beacd787e6e4b30df6e0a1ac340d","receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-05-18T01:15:31.457148Z","signature_b64":"6MFUQO/x2BAF5plfXmp1qGBmeIOGRfdFeTdBZUX/tWNc08ruOJsKx1tM/+x6ost0tl/hlQwy7T4gH5z6hNxHAw==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"7b43a470800b97f0fffd3c80c4f83c2cf608beacd787e6e4b30df6e0a1ac340d","last_reissued_at":"2026-05-18T01:15:31.456420Z","signature_status":"signed_v1","first_computed_at":"2026-05-18T01:15:31.456420Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"source_kind":"arxiv","source_id":"1605.01789","source_version":1,"attestation_state":"computed"},"signer":{"signer_id":"pith.science","signer_type":"pith_registry","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"created_at":"2026-05-18T01:15:31Z","supersedes":[],"prev_event":null,"signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"TcqO/Kvun1ZLstb+AOlzWeePCuyFYWUmqUutuj1FtjQKPDu5EG5T74+DD+nBMB0dL4sTqGd8Unm8c61qF6TSDA==","signed_message":"open_graph_event_sha256_bytes","signed_at":"2026-06-02T22:20:00.718774Z"},"content_sha256":"089485bf0dac87782d2fe96eadc0e5ab88fa5e2eaa4599f8f173ab8846476d0a","schema_version":"1.0","event_id":"sha256:089485bf0dac87782d2fe96eadc0e5ab88fa5e2eaa4599f8f173ab8846476d0a"},{"event_type":"graph_snapshot","subject_pith_number":"pith:2016:PNB2I4EABOL7B775HSAMJ6B4FT","target":"graph","payload":{"graph_snapshot":{"paper":{"title":"Smart packaging of electronics and integrated MEMS devices using LTCC","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cond-mat.mtrl-sci","authors_text":"A. M. Vadiraj, Suhas Kumar","submitted_at":"2016-05-05T23:41:52Z","abstract_excerpt":"Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit within itself, apart from its enhanced RF functionality as against many lossy materials used. The advantages of LTCC in terms of frequency response, cost, ease of fabrication, etc over many other packaging materials are presented. The applicability of LTCC as a packaging material, circuit mounting material, substrate material or a base material for micro devices"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1605.01789","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"verdict_id":null},"signer":{"signer_id":"pith.science","signer_type":"pith_registry","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"created_at":"2026-05-18T01:15:31Z","supersedes":[],"prev_event":null,"signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"XYu3vWBIEBS9Ed60hPwujBCCidHpiC1xgz41YpyTpfMTpSjmMsfHFNhagCvDFxr45658ELGQ5QMofDbPZdzhDA==","signed_message":"open_graph_event_sha256_bytes","signed_at":"2026-06-02T22:20:00.719104Z"},"content_sha256":"ea08e91e67da3d5e1d8fc6f03fdfc2647ecee3a6b6865dc41ae9cb82423d7a31","schema_version":"1.0","event_id":"sha256:ea08e91e67da3d5e1d8fc6f03fdfc2647ecee3a6b6865dc41ae9cb82423d7a31"}],"timestamp_proofs":[],"mirror_hints":[{"mirror_type":"https","name":"Pith Resolver","base_url":"https://pith.science","bundle_url":"https://pith.science/pith/PNB2I4EABOL7B775HSAMJ6B4FT/bundle.json","state_url":"https://pith.science/pith/PNB2I4EABOL7B775HSAMJ6B4FT/state.json","well_known_bundle_url":"https://pith.science/.well-known/pith/PNB2I4EABOL7B775HSAMJ6B4FT/bundle.json","status":"primary"}],"public_keys":[{"key_id":"pith-v1-2026-05","algorithm":"ed25519","format":"raw","public_key_b64":"stVStoiQhXFxp4s2pdzPNoqVNBMojDU/fJ2db5S3CbM=","public_key_hex":"b2d552b68890857171a78b36a5dccf368a953413288c353f7c9d9d6f94b709b3","fingerprint_sha256_b32_first128bits":"RVFV5Z2OI2J3ZUO7ERDEBCYNKS","fingerprint_sha256_hex":"8d4b5ee74e4693bcd1df2446408b0d54","rotates_at":null,"url":"https://pith.science/pith-signing-key.json","notes":"Pith uses this Ed25519 key to sign canonical record SHA-256 digests. Verify with: ed25519_verify(public_key, message=canonical_sha256_bytes, signature=base64decode(signature_b64))."}],"merge_version":"pith-open-graph-merge-v1","built_at":"2026-06-02T22:20:00Z","links":{"resolver":"https://pith.science/pith/PNB2I4EABOL7B775HSAMJ6B4FT","bundle":"https://pith.science/pith/PNB2I4EABOL7B775HSAMJ6B4FT/bundle.json","state":"https://pith.science/pith/PNB2I4EABOL7B775HSAMJ6B4FT/state.json","well_known_bundle":"https://pith.science/.well-known/pith/PNB2I4EABOL7B775HSAMJ6B4FT/bundle.json"},"state":{"state_type":"pith_open_graph_state","state_version":"1.0","pith_number":"pith:2016:PNB2I4EABOL7B775HSAMJ6B4FT","merge_version":"pith-open-graph-merge-v1","event_count":2,"valid_event_count":2,"invalid_event_count":0,"equivocation_count":0,"current":{"canonical_record":{"metadata":{"abstract_canon_sha256":"23a41b98eae78357789980a3d22b7a380f871acf5f14c89712f7b7d0ffacad89","cross_cats_sorted":[],"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.mtrl-sci","submitted_at":"2016-05-05T23:41:52Z","title_canon_sha256":"1b1ffa0fc792629a3a4d4178fa48fb83aa27f6946de08efc66e7af466b25c16b"},"schema_version":"1.0","source":{"id":"1605.01789","kind":"arxiv","version":1}},"source_aliases":[{"alias_kind":"arxiv","alias_value":"1605.01789","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"arxiv_version","alias_value":"1605.01789v1","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.1605.01789","created_at":"2026-05-18T01:15:31Z"},{"alias_kind":"pith_short_12","alias_value":"PNB2I4EABOL7","created_at":"2026-05-18T12:30:39Z"},{"alias_kind":"pith_short_16","alias_value":"PNB2I4EABOL7B775","created_at":"2026-05-18T12:30:39Z"},{"alias_kind":"pith_short_8","alias_value":"PNB2I4EA","created_at":"2026-05-18T12:30:39Z"}],"graph_snapshots":[{"event_id":"sha256:ea08e91e67da3d5e1d8fc6f03fdfc2647ecee3a6b6865dc41ae9cb82423d7a31","target":"graph","created_at":"2026-05-18T01:15:31Z","signer":{"key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signer_id":"pith.science","signer_type":"pith_registry"},"payload":{"graph_snapshot":{"author_claims":{"count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","strong_count":0},"builder_version":"pith-number-builder-2026-05-17-v1","claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"paper":{"abstract_excerpt":"Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit within itself, apart from its enhanced RF functionality as against many lossy materials used. The advantages of LTCC in terms of frequency response, cost, ease of fabrication, etc over many other packaging materials are presented. The applicability of LTCC as a packaging material, circuit mounting material, substrate material or a base material for micro devices","authors_text":"A. M. Vadiraj, Suhas Kumar","cross_cats":[],"headline":"","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.mtrl-sci","submitted_at":"2016-05-05T23:41:52Z","title":"Smart packaging of electronics and integrated MEMS devices using LTCC"},"references":{"count":0,"internal_anchors":0,"resolved_work":0,"sample":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1605.01789","kind":"arxiv","version":1},"verdict":{"created_at":null,"id":null,"model_set":{},"one_line_summary":"","pipeline_version":null,"pith_extraction_headline":"","strongest_claim":"","weakest_assumption":""}},"verdict_id":null}}],"author_attestations":[],"timestamp_anchors":[],"storage_attestations":[],"citation_signatures":[],"replication_records":[],"corrections":[],"mirror_hints":[],"record_created":{"event_id":"sha256:089485bf0dac87782d2fe96eadc0e5ab88fa5e2eaa4599f8f173ab8846476d0a","target":"record","created_at":"2026-05-18T01:15:31Z","signer":{"key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signer_id":"pith.science","signer_type":"pith_registry"},"payload":{"attestation_state":"computed","canonical_record":{"metadata":{"abstract_canon_sha256":"23a41b98eae78357789980a3d22b7a380f871acf5f14c89712f7b7d0ffacad89","cross_cats_sorted":[],"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.mtrl-sci","submitted_at":"2016-05-05T23:41:52Z","title_canon_sha256":"1b1ffa0fc792629a3a4d4178fa48fb83aa27f6946de08efc66e7af466b25c16b"},"schema_version":"1.0","source":{"id":"1605.01789","kind":"arxiv","version":1}},"canonical_sha256":"7b43a470800b97f0fffd3c80c4f83c2cf608beacd787e6e4b30df6e0a1ac340d","receipt":{"algorithm":"ed25519","builder_version":"pith-number-builder-2026-05-17-v1","canonical_sha256":"7b43a470800b97f0fffd3c80c4f83c2cf608beacd787e6e4b30df6e0a1ac340d","first_computed_at":"2026-05-18T01:15:31.456420Z","key_id":"pith-v1-2026-05","kind":"pith_receipt","last_reissued_at":"2026-05-18T01:15:31.456420Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","receipt_version":"0.3","signature_b64":"6MFUQO/x2BAF5plfXmp1qGBmeIOGRfdFeTdBZUX/tWNc08ruOJsKx1tM/+x6ost0tl/hlQwy7T4gH5z6hNxHAw==","signature_status":"signed_v1","signed_at":"2026-05-18T01:15:31.457148Z","signed_message":"canonical_sha256_bytes"},"source_id":"1605.01789","source_kind":"arxiv","source_version":1}}},"equivocations":[],"invalid_events":[],"applied_event_ids":["sha256:089485bf0dac87782d2fe96eadc0e5ab88fa5e2eaa4599f8f173ab8846476d0a","sha256:ea08e91e67da3d5e1d8fc6f03fdfc2647ecee3a6b6865dc41ae9cb82423d7a31"],"state_sha256":"947f42032eb4cf4f3a470477b4e16be62f36956077e5b2b24a3bbf5cbf66e772"},"bundle_signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"ubGm1P7woIC85JOzD9/XbaY9347cSEWb72UEVW1FvBnEB7WZo0qhTfvNIUB3DvOP2+HSHODuxe2G8F8CZW30DA==","signed_message":"bundle_sha256_bytes","signed_at":"2026-06-02T22:20:00.720824Z","bundle_sha256":"3a7e4d0da0539835792cf149c19631e9fb72943229e05ea0c6f8abdecb333557"}}