{"bundle_type":"pith_open_graph_bundle","bundle_version":"1.0","pith_number":"pith:2016:ZKU3X3R67HV4MB6727HSHIQ6RA","short_pith_number":"pith:ZKU3X3R6","canonical_record":{"source":{"id":"1604.08926","kind":"arxiv","version":1},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cs.ET","submitted_at":"2016-04-29T18:08:47Z","cross_cats_sorted":[],"title_canon_sha256":"237fb6aaff0b321841ee2e1f89d015a5b06ca47acfc9e2055c7f541ab7e520c8","abstract_canon_sha256":"09d32c9b63be373b59b9dd77fdb53a6123c33bea77918b3571b37563bca354c4"},"schema_version":"1.0"},"canonical_sha256":"caa9bbee3ef9ebc607dfd7cf23a21e881d7487bec2de24052f7282e016b883f7","source":{"kind":"arxiv","id":"1604.08926","version":1},"source_aliases":[{"alias_kind":"arxiv","alias_value":"1604.08926","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"arxiv_version","alias_value":"1604.08926v1","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.1604.08926","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"pith_short_12","alias_value":"ZKU3X3R67HV4","created_at":"2026-05-18T12:30:53Z"},{"alias_kind":"pith_short_16","alias_value":"ZKU3X3R67HV4MB67","created_at":"2026-05-18T12:30:53Z"},{"alias_kind":"pith_short_8","alias_value":"ZKU3X3R6","created_at":"2026-05-18T12:30:53Z"}],"events":[{"event_type":"record_created","subject_pith_number":"pith:2016:ZKU3X3R67HV4MB6727HSHIQ6RA","target":"record","payload":{"canonical_record":{"source":{"id":"1604.08926","kind":"arxiv","version":1},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cs.ET","submitted_at":"2016-04-29T18:08:47Z","cross_cats_sorted":[],"title_canon_sha256":"237fb6aaff0b321841ee2e1f89d015a5b06ca47acfc9e2055c7f541ab7e520c8","abstract_canon_sha256":"09d32c9b63be373b59b9dd77fdb53a6123c33bea77918b3571b37563bca354c4"},"schema_version":"1.0"},"canonical_sha256":"caa9bbee3ef9ebc607dfd7cf23a21e881d7487bec2de24052f7282e016b883f7","receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-05-18T01:16:01.404236Z","signature_b64":"u3OqICw2MWjJwuKm7iEyRZs27pAwr9ZAIC9kn+4diDvXeqjlkTSnfUtMHR0pGcP3Pkew+yAX07llpC75Sht1Ag==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"caa9bbee3ef9ebc607dfd7cf23a21e881d7487bec2de24052f7282e016b883f7","last_reissued_at":"2026-05-18T01:16:01.403716Z","signature_status":"signed_v1","first_computed_at":"2026-05-18T01:16:01.403716Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"source_kind":"arxiv","source_id":"1604.08926","source_version":1,"attestation_state":"computed"},"signer":{"signer_id":"pith.science","signer_type":"pith_registry","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"created_at":"2026-05-18T01:16:01Z","supersedes":[],"prev_event":null,"signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"qYaOHEP2C+XGUn/Rttm0kJu0dUMbZLEYSYRsCHdP7yWHjZr4IQIVvLuymWzoxw2VUvIHgPDfzvTyBhZiaSIMDg==","signed_message":"open_graph_event_sha256_bytes","signed_at":"2026-06-11T09:46:04.014351Z"},"content_sha256":"e684638f8b08afb62d2b866992de0debf615f90c655f4ec820bb331488430bbd","schema_version":"1.0","event_id":"sha256:e684638f8b08afb62d2b866992de0debf615f90c655f4ec820bb331488430bbd"},{"event_type":"graph_snapshot","subject_pith_number":"pith:2016:ZKU3X3R67HV4MB6727HSHIQ6RA","target":"graph","payload":{"graph_snapshot":{"paper":{"title":"Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.ET","authors_text":"Csaba Andras Moritz, Jiajun Shi, Mingyu Li, Mostafizur Rahman, Sachin Bhat, Santosh Khasanvis","submitted_at":"2016-04-29T18:08:47Z","abstract_excerpt":"Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging connectivity, routing and layer alignment between layers when connected in 3D, with a routing access that can be even worse than 2D CMOS, which fundamentally limits their potential. To fully exploit the opportunities in the third dimension, we propose Skybridge-3D-CMOS (S3DC), a fine-grained 3D integration approach that is directly composed in 3D, utilizing the"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1604.08926","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"verdict_id":null},"signer":{"signer_id":"pith.science","signer_type":"pith_registry","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"created_at":"2026-05-18T01:16:01Z","supersedes":[],"prev_event":null,"signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"lHpQU7JACsxszZSniTaM6JhjCLAku+YmvmfQ7xQBYYOa0lRMGmKpEIZ1Y1cYcOmBj6DsZ22YaXjUpSlxp6uFBg==","signed_message":"open_graph_event_sha256_bytes","signed_at":"2026-06-11T09:46:04.014703Z"},"content_sha256":"e55b8c62f52884142d763efad699a7ad23531819b110f07b1f40d262dee26bbb","schema_version":"1.0","event_id":"sha256:e55b8c62f52884142d763efad699a7ad23531819b110f07b1f40d262dee26bbb"}],"timestamp_proofs":[],"mirror_hints":[{"mirror_type":"https","name":"Pith Resolver","base_url":"https://pith.science","bundle_url":"https://pith.science/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/bundle.json","state_url":"https://pith.science/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/state.json","well_known_bundle_url":"https://pith.science/.well-known/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/bundle.json","status":"primary"}],"public_keys":[{"key_id":"pith-v1-2026-05","algorithm":"ed25519","format":"raw","public_key_b64":"stVStoiQhXFxp4s2pdzPNoqVNBMojDU/fJ2db5S3CbM=","public_key_hex":"b2d552b68890857171a78b36a5dccf368a953413288c353f7c9d9d6f94b709b3","fingerprint_sha256_b32_first128bits":"RVFV5Z2OI2J3ZUO7ERDEBCYNKS","fingerprint_sha256_hex":"8d4b5ee74e4693bcd1df2446408b0d54","rotates_at":null,"url":"https://pith.science/pith-signing-key.json","notes":"Pith uses this Ed25519 key to sign canonical record SHA-256 digests. Verify with: ed25519_verify(public_key, message=canonical_sha256_bytes, signature=base64decode(signature_b64))."}],"merge_version":"pith-open-graph-merge-v1","built_at":"2026-06-11T09:46:04Z","links":{"resolver":"https://pith.science/pith/ZKU3X3R67HV4MB6727HSHIQ6RA","bundle":"https://pith.science/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/bundle.json","state":"https://pith.science/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/state.json","well_known_bundle":"https://pith.science/.well-known/pith/ZKU3X3R67HV4MB6727HSHIQ6RA/bundle.json"},"state":{"state_type":"pith_open_graph_state","state_version":"1.0","pith_number":"pith:2016:ZKU3X3R67HV4MB6727HSHIQ6RA","merge_version":"pith-open-graph-merge-v1","event_count":2,"valid_event_count":2,"invalid_event_count":0,"equivocation_count":0,"current":{"canonical_record":{"metadata":{"abstract_canon_sha256":"09d32c9b63be373b59b9dd77fdb53a6123c33bea77918b3571b37563bca354c4","cross_cats_sorted":[],"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cs.ET","submitted_at":"2016-04-29T18:08:47Z","title_canon_sha256":"237fb6aaff0b321841ee2e1f89d015a5b06ca47acfc9e2055c7f541ab7e520c8"},"schema_version":"1.0","source":{"id":"1604.08926","kind":"arxiv","version":1}},"source_aliases":[{"alias_kind":"arxiv","alias_value":"1604.08926","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"arxiv_version","alias_value":"1604.08926v1","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.1604.08926","created_at":"2026-05-18T01:16:01Z"},{"alias_kind":"pith_short_12","alias_value":"ZKU3X3R67HV4","created_at":"2026-05-18T12:30:53Z"},{"alias_kind":"pith_short_16","alias_value":"ZKU3X3R67HV4MB67","created_at":"2026-05-18T12:30:53Z"},{"alias_kind":"pith_short_8","alias_value":"ZKU3X3R6","created_at":"2026-05-18T12:30:53Z"}],"graph_snapshots":[{"event_id":"sha256:e55b8c62f52884142d763efad699a7ad23531819b110f07b1f40d262dee26bbb","target":"graph","created_at":"2026-05-18T01:16:01Z","signer":{"key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signer_id":"pith.science","signer_type":"pith_registry"},"payload":{"graph_snapshot":{"author_claims":{"count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","strong_count":0},"builder_version":"pith-number-builder-2026-05-17-v1","claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"paper":{"abstract_excerpt":"Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging connectivity, routing and layer alignment between layers when connected in 3D, with a routing access that can be even worse than 2D CMOS, which fundamentally limits their potential. To fully exploit the opportunities in the third dimension, we propose Skybridge-3D-CMOS (S3DC), a fine-grained 3D integration approach that is directly composed in 3D, utilizing the","authors_text":"Csaba Andras Moritz, Jiajun Shi, Mingyu Li, Mostafizur Rahman, Sachin Bhat, Santosh Khasanvis","cross_cats":[],"headline":"","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cs.ET","submitted_at":"2016-04-29T18:08:47Z","title":"Skybridge-3D-CMOS: A Vertically-Composed Fine-Grained 3D CMOS Integrated Circuit Technology"},"references":{"count":0,"internal_anchors":0,"resolved_work":0,"sample":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1604.08926","kind":"arxiv","version":1},"verdict":{"created_at":null,"id":null,"model_set":{},"one_line_summary":"","pipeline_version":null,"pith_extraction_headline":"","strongest_claim":"","weakest_assumption":""}},"verdict_id":null}}],"author_attestations":[],"timestamp_anchors":[],"storage_attestations":[],"citation_signatures":[],"replication_records":[],"corrections":[],"mirror_hints":[],"record_created":{"event_id":"sha256:e684638f8b08afb62d2b866992de0debf615f90c655f4ec820bb331488430bbd","target":"record","created_at":"2026-05-18T01:16:01Z","signer":{"key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signer_id":"pith.science","signer_type":"pith_registry"},"payload":{"attestation_state":"computed","canonical_record":{"metadata":{"abstract_canon_sha256":"09d32c9b63be373b59b9dd77fdb53a6123c33bea77918b3571b37563bca354c4","cross_cats_sorted":[],"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cs.ET","submitted_at":"2016-04-29T18:08:47Z","title_canon_sha256":"237fb6aaff0b321841ee2e1f89d015a5b06ca47acfc9e2055c7f541ab7e520c8"},"schema_version":"1.0","source":{"id":"1604.08926","kind":"arxiv","version":1}},"canonical_sha256":"caa9bbee3ef9ebc607dfd7cf23a21e881d7487bec2de24052f7282e016b883f7","receipt":{"algorithm":"ed25519","builder_version":"pith-number-builder-2026-05-17-v1","canonical_sha256":"caa9bbee3ef9ebc607dfd7cf23a21e881d7487bec2de24052f7282e016b883f7","first_computed_at":"2026-05-18T01:16:01.403716Z","key_id":"pith-v1-2026-05","kind":"pith_receipt","last_reissued_at":"2026-05-18T01:16:01.403716Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","receipt_version":"0.3","signature_b64":"u3OqICw2MWjJwuKm7iEyRZs27pAwr9ZAIC9kn+4diDvXeqjlkTSnfUtMHR0pGcP3Pkew+yAX07llpC75Sht1Ag==","signature_status":"signed_v1","signed_at":"2026-05-18T01:16:01.404236Z","signed_message":"canonical_sha256_bytes"},"source_id":"1604.08926","source_kind":"arxiv","source_version":1}}},"equivocations":[],"invalid_events":[],"applied_event_ids":["sha256:e684638f8b08afb62d2b866992de0debf615f90c655f4ec820bb331488430bbd","sha256:e55b8c62f52884142d763efad699a7ad23531819b110f07b1f40d262dee26bbb"],"state_sha256":"e397135a09ed7a89d0934a7e45c5118422b8aded3dbc812349673c78b756d780"},"bundle_signature":{"signature_status":"signed_v1","algorithm":"ed25519","key_id":"pith-v1-2026-05","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54","signature_b64":"tnPPkvxEJ99zAUx+ciCO4IEiGnKruyw9ChdIxjXCz+vJZtbYRP1vbYqq4T/JyTVBzZHKcpMKiFpyVzXRKrA0Bg==","signed_message":"bundle_sha256_bytes","signed_at":"2026-06-11T09:46:04.016581Z","bundle_sha256":"76226a999e13612d2825858ee4e1250783cdf9bea097652c4dae9177d40d6b34"}}