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R. Zeng S.X. Dou

Identifiers

  • name variant R. Zeng S.X. Dou 0.60 · backfill

Papers (1)

  1. Thermal strain-induced enhancement of electromagnetic properties in SiC-MgB2 composites cond-mat.supr-con · 2008 · author #1

Mentions

  • 0808.1136 #1 · backfill · confidence 0.70 R. Zeng S.X. Dou

Frequent Coauthors