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Falong Zhou

Identifiers

  • name variant Falong Zhou 0.60 · backfill

Papers (1)

  1. From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration cond-mat.mes-hall · 2024 · author #7

Mentions

  • 2411.00309 #7 · arxiv_oai · confidence 0.70 Falong Zhou

Frequent Coauthors