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Nick Bosco

Identifiers

  • name variant Nick Bosco 0.60 · backfill

Papers (1)

  1. III-V/Si Wafer Bonding Using Transparent, Conductive Oxide Interlayers cond-mat.mtrl-sci · 2015 · author #7

Mentions

  • 1505.05453 #7 · backfill · confidence 0.70 Nick Bosco

Frequent Coauthors