A.T. Wu

Identifiers

• name variant A.T. Wu 0.60 · backfill

Papers (1)

1. Buffered Electropolishing -- a New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities To be Used in Particle Accelerators physics.acc-ph · 2009 · author #1

Mentions

• 0905.1957 #1 · backfill · confidence 0.70 A.T. Wu

Frequent Coauthors

• C. Reece 1 shared papers
• E.D. Wang 1 shared papers
• F. Eozenou 1 shared papers
• G. Ciovati 1 shared papers
• H. Phillips 1 shared papers
• H. Tian 1 shared papers
• J. Mammosser 1 shared papers
• J. Williams 1 shared papers
• L. Lin 1 shared papers
• R.A. Rimmer 1 shared papers
• R. Manus 1 shared papers
• S. Jin 1 shared papers
• W. Sommer 1 shared papers
• X.Y. Lu 1 shared papers