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Robert Scherzer

Identifiers

  • name variant Robert Scherzer 0.60 · backfill

Papers (1)

  1. Modelling and simulation of adhesive curing processes in bonded piezo metal composites cond-mat.mtrl-sci · 2013 · author #3

Mentions

  • 1310.8264 #3 · backfill · confidence 0.70 Robert Scherzer

Frequent Coauthors