R.T. Tjeung

Identifiers

• name variant R.T. Tjeung 0.60 · backfill

Papers (1)

1. Formation of Embedded Microstructures by Thermal Activated Solvent Bonding cs.OH · 2008 · author #2

Mentions

• 0802.3064 #2 · backfill · confidence 0.70 R.T. Tjeung

Frequent Coauthors

• A.C.W. Lu 1 shared papers
• I. Rodriguez 1 shared papers
• N. De Rooij 1 shared papers
• S.H. Ng 1 shared papers
• Z.F. Wang 1 shared papers