B. Maj

Identifiers

• name variant B. Maj 0.60 · backfill

Papers (1)

1. Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package physics.gen-ph · 2008 · author #2

Mentions

• 0801.1003 #2 · backfill · confidence 0.70 B. Maj

Frequent Coauthors

• G. Balanon 1 shared papers
• J. Czernohorsky 1 shared papers
• L. Wright 1 shared papers
• Matthias Viering 1 shared papers