T. Shibutani

Identifiers

• name variant T. Shibutani 0.60 · backfill

Papers (3)

1. New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors physics.gen-ph · 2008 · author #3
2. Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors cond-mat.mtrl-sci · 2007 · author #3
3. Modeling with structure of resins in electonic compornents cond-mat.mtrl-sci · 2007 · author #2

Mentions

• 0801.1004 #3 · backfill · confidence 0.70 T. Shibutani
• 0709.1872 #3 · backfill · confidence 0.70 T. Shibutani
• 0709.1860 #2 · backfill · confidence 0.70 T. Shibutani

Frequent Coauthors

• M. Shiratori 3 shared papers
• Qiang Yu 2 shared papers
• Q. Yu 1 shared papers
• Satoshi Kondo 1 shared papers
• S. Kondo 1 shared papers
• T. Matsumoto 1 shared papers
• T. Matsuzaki 1 shared papers