T. Weir

Identifiers

• name variant T. Weir 0.60 · backfill

Papers (1)

1. Deep Sub-Micron Stud-Via Technology for Superconductor VLSI Circuits cond-mat.supr-con · 2013 · author #3

Mentions

• 1309.7505 #3 · backfill · confidence 0.70 T. Weir

Frequent Coauthors

• L. Johnson 1 shared papers
• M.A. Gouker 1 shared papers
• Sergey K. Tolpygo 1 shared papers
• V. Bolkhovsky 1 shared papers
• W.D. Oliver 1 shared papers