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M. Rencz

Identifiers

  • name variant M. Rencz 0.60 · backfill

Papers (11)

  1. Package Hermeticity Testing with Thermal Transient Measurements cs.OH · 2008 · author #2
  2. Contactless Thermal Characterization of High Temperature Test Chamber cs.OH · 2008 · author #4
  3. A novel method for fatigue testing of MEMS devices containing movable elements cs.OH · 2008 · author #2
  4. Ni-MH battery modelling for ambient intelligence applications cs.OH · 2008 · author #3
  5. Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors cs.OH · 2008 · author #4
  6. Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers physics.gen-ph · 2008 · author #4
  7. Short time die attach characterisation of semiconductor devices physics.gen-ph · 2008 · author #2
  8. Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array cs.OH · 2007 · author #3
  9. Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology cs.OH · 2007 · author #3
  10. Creating temperature dependent Ni-MH battery models for low power mobile devices cond-mat.mtrl-sci · 2007 · author #3
  11. Contactless Thermal Characterization Method of PCB-s Using Different IR Sensor Arrays cond-mat.mtrl-sci · 2007 · author #3

Mentions

  • 0805.0941 #2 · backfill · confidence 0.70 M. Rencz
  • 0805.0865 #4 · backfill · confidence 0.70 M. Rencz
  • 0802.3091 #2 · backfill · confidence 0.70 M. Rencz
  • 0802.3053 #3 · backfill · confidence 0.70 M. Rencz
  • 0802.3049 #4 · backfill · confidence 0.70 M. Rencz
  • 0801.1030 #4 · backfill · confidence 0.70 M. Rencz
  • 0801.1007 #2 · backfill · confidence 0.70 M. Rencz
  • 0711.3324 #3 · backfill · confidence 0.70 M. Rencz
  • 0711.3301 #3 · backfill · confidence 0.70 M. Rencz
  • 0709.1873 #3 · backfill · confidence 0.70 M. Rencz
  • 0709.1821 #3 · backfill · confidence 0.70 M. Rencz

Frequent Coauthors