Wang Kun

Identifiers

• name variant Wang Kun 0.60 · backfill

Papers (1)

1. Copper Replaces Tin: A Copper based Gelling Catalyst for Poly-Urethane from Discarded Motherboard cond-mat.mtrl-sci · 2013 · author #4

Mentions

• 1307.2671 #4 · backfill · confidence 0.70 Wang Kun

Frequent Coauthors

• Arijit Dasgupta 1 shared papers
• Atharva Sahasrabudhe 1 shared papers
• Bibudha Parasar 1 shared papers
• Dandan Yuan 1 shared papers
• Gao Wen Jing 1 shared papers
• Peng Wang 1 shared papers
• Rongxin Yuan 1 shared papers
• Soumitra Barman 1 shared papers
• Soumyajit Roy 1 shared papers