A homogenization-based transient thermal analysis workflow is demonstrated for 3D heterogeneous integrated chip stacks using layout file inputs to generate effective property maps.
Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Archi- tectures
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Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
A homogenization-based transient thermal analysis workflow is demonstrated for 3D heterogeneous integrated chip stacks using layout file inputs to generate effective property maps.