An ANN and a BNN predict SiO2 etch depth from process parameters and from RGB color values, with held-out MSEs of 7.33 and 10.38 nm^2 respectively.
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In-situ and Non-contact Etch Depth Prediction in Plasma Etching via Machine Learning (ANN & BNN) and Digital Image Colorimetry
An ANN and a BNN predict SiO2 etch depth from process parameters and from RGB color values, with held-out MSEs of 7.33 and 10.38 nm^2 respectively.