A coupled Kirchhoff-Love plate and Reynolds lubrication finite element model for wafer-to-wafer bonding is derived and implemented in FEniCSx, reproducing experimental probe-displacement histories.
Simulation of Cu pad 20 expansion in wafer-to-wafer Cu/SiCN hybrid bonding.Microelectronics Reliability, 138:114716
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Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation
A coupled Kirchhoff-Love plate and Reynolds lubrication finite element model for wafer-to-wafer bonding is derived and implemented in FEniCSx, reproducing experimental probe-displacement histories.