A POD plus multi-fidelity kriging surrogate predicts wafer temperature fields more accurately than single-fidelity kriging and improves electrostatic chuck designs at lower simulation cost.
Vacuum 41(7-9):1957--1961
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Design optimization of semiconductor manufacturing equipment using a novel multi-fidelity surrogate modeling approach
A POD plus multi-fidelity kriging surrogate predicts wafer temperature fields more accurately than single-fidelity kriging and improves electrostatic chuck designs at lower simulation cost.