Vacuum sublimation fills arc-discharge SWCNTs most efficiently with TTF or TCNQ for endohedral doping; FES then removes external adsorbates without solvents while preserving processability and sorting.
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Comparative Evaluation of Encapsulation Methods for Endohedral Doping of Single-Wall Carbon Nanotubes
Vacuum sublimation fills arc-discharge SWCNTs most efficiently with TTF or TCNQ for endohedral doping; FES then removes external adsorbates without solvents while preserving processability and sorting.