Iterative cutting-plane generation and arc preprocessing reduce TSP model size and yield performance gains on classical, direct quantum, and hybrid D-Wave solvers.
2025 IEEE International Conference on Quantum Computing and Engineering (QCE) , volume=
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Cutting-plane methodology via quantum optimization for solving the Traveling Salesman Problem
Iterative cutting-plane generation and arc preprocessing reduce TSP model size and yield performance gains on classical, direct quantum, and hybrid D-Wave solvers.