Characterization of HE kernels on commercial UPMEM PIM identifies modular multiplication and per-bank capacity as dominant bottlenecks and concludes PIM becomes competitive with CPU/GPU once those are addressed.
184QPS/W 64Mb/mm 2 3D Logic-to-DRAM Hybrid Bonding with Process- Near-Memory Engine for Recommendation System
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HE-PIM: Demystifying Homomorphic Operations on a Real-world Processing-in-Memory System
Characterization of HE kernels on commercial UPMEM PIM identifies modular multiplication and per-bank capacity as dominant bottlenecks and concludes PIM becomes competitive with CPU/GPU once those are addressed.