CMOS-compatible, 200 mm wafer fabrication of 24-qubit chips with flip-chip bonding via KOH-etched Si-island microbumps yields functional qubits with T1 up to 15 µs.
Bizn´ arov´ a, A
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3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
CMOS-compatible, 200 mm wafer fabrication of 24-qubit chips with flip-chip bonding via KOH-etched Si-island microbumps yields functional qubits with T1 up to 15 µs.