Heavier inert gases reduce nanoscale asperities on cobalt films more efficiently and with lower etching rates than lighter gases, as shown by molecular dynamics and AFM.
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Eliminating nanometer-scale asperities on metallic thin films through plasma modification processes studied by molecular dynamics and AFM
Heavier inert gases reduce nanoscale asperities on cobalt films more efficiently and with lower etching rates than lighter gases, as shown by molecular dynamics and AFM.