The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.
High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits; High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits,
1 Pith paper cite this work. Polarity classification is still indexing.
1
Pith paper citing it
fields
cs.AR 1years
2026 1verdicts
UNVERDICTED 1representative citing papers
citing papers explorer
-
A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.